Please use this identifier to cite or link to this item: https://hdl.handle.net/11681/40079
Title: Microscale dynamics between dust and microorganisms in alpine snowpack
Authors: Thurston, Alison K.
Courville, Zoe R.
Farnsworth, Lauren B.
Lieblappen, Ross M.
Rosten, Shelby A.
Fegyveresi, John M.
Doherty, Stacey J.
Jones, Robert M.
Barbato, Robyn A.
Keywords: Dust
Microorganisms
Geospatial data
Snow
Publisher: Cold Regions Research and Engineering Laboratory (U.S.)
Engineer Research and Development Center (U.S.)
Series/Report no.: Technical Report (Engineer Research and Development Center (U.S.)) ; no. ERDC/CRREL TR-20-12
Abstract: Dust particles carry microbial and chemical signatures from source regions to deposition regions. Dust and its occupying microorganisms are incorporated into, and can alter, snowpack physical properties including snow structure and resultant radiative and mechanical properties that in turn affect larger-scale properties, including surrounding hydrology and maneuverability. Microorganisms attached to deposited dust maintain genetic evidence of source substrates and can be potentially used as bio-sensors. The objective of this study was to investigate the impact of dust-associated microbial deposition on snowpack and microstructure. As part of this effort, we characterized the microbial communities deposited through dust transport, examined dust provenance, and identified the microscale location and fate of dust within a changing snow matrix. We found dust characteristics varied with deposition event and that dust particles were generally embedded in the snow grains, with a small fraction of the dust particles residing on the exterior of the snow matrix. Dust deposition appears to retard expected late season snow grain growth. Both bacteria and fungi were identified in the collected snow samples.
Description: Technical Report
Gov't Doc #: ERDC/CRREL TR-20-12
Rights: Approved for Public Release; Distribution is Unlimited
URI: https://hdl.handle.net/11681/40079
http://dx.doi.org/10.21079/11681/40079
Appears in Collections:Technical Report

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