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Evaluation of high temperature dielectric films for high voltage power electronic applications

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Abstract

Three high temperature films, polyimide, Teflon perfluoroalkoxy and poly-P-xylene, were evaluated for possible use in high voltage power electronic applications, such as in high energy density capacitors, cables and microelectronic circuits. The dielectric properties, including permittivity and dielectric loss, were obtained in the frequency range of 50 Hz to 100 kHz at temperatures up to 200°C. The dielectric strengths at 60 Hz were determined as a function of temperature to 250°C. Confocal laser microscopy was performed to diagnose for voids and microimperfections within the film structure. The results obtained indicate that all films evaluated are capable of maintaining their high voltage properties, with minimal degradation, at temperatures up to 200°C. However, above 200°C, they lose some of their electrical properties. These films may therefore become viable candidates for high voltage power electronic applications at high temperatures.

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Authors and Affiliations

  1. Space Power Insulation Institute, SUNY at Buffalo, 14260, NY, USA

    J. L. Suthar & J. R. Laghari

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  1. J. L. Suthar
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  2. J. R. Laghari
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Suthar, J.L., Laghari, J.R. Evaluation of high temperature dielectric films for high voltage power electronic applications. J Mater Sci: Mater Electron 3, 77–81 (1992). https://doi.org/10.1007/BF00695720

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