Abstract
The advanced electron beam melting (EBM) system with the combination of vacuum refining and directional solidification (DS) performed the purification of large amounts of metallurgical grade silicon (MG-Si). In order to increase grain size or to align columnar grains being parallel to DS pulling direction in Si ingots, non-irradiated inner diameters in an EB pattern in the DS process were varied at a range of 5–35 mm. Average grain size increased with increasing non-irradiated inner diameter due to a smaller temperature gradient during the solidification of Si melts. However, the slope of the grain boundary inclined towards the ingot axis, which led to the formation of a triple junction in the ingot center in the case of large non-irradiated inner diameter. This happened despite there being a large temperature gradient due to the turbulent flow in the pool. This work reported that a purity of 99.8% for MG-Si was improved to above 99.999% with an ingot yield of 90% for 1 h.