Tensile and Fatigue Properties of Miniature Size Specimens of Sn-5Sb Lead-Free Solder

Kyosuke Kobayashi; Ikuo Shohji; Hiroaki Hokazono

doi:10.4028/www.scientific.net/MSF.879.2377

Paper Titles

Otoacoustic Emissions as a Promising Diagnostic Tool for the Early Detection of Mild Hearing Impairment - Technical Advances in Acquisition, Analysis and Modeling
p.2355

Near Infrared Device for Tissue Inflammation Evaluation
p.2361

Evolution of Recrystallization Textures in Cold-Rolled Commercially Pure Aluminum
p.2365

Change in Mechanical Strength and Bone Contact Ratio of Beta-Type TNTZ Subjected to Mechanical Surface Modification
p.2371

Tensile and Fatigue Properties of Miniature Size Specimens of Sn-5Sb Lead-Free Solder
p.2377

Effect of Sr Addition on the Solidification Structure in Al-6mass%Mg-3mass%Si Alloy
p.2383

Analysis of Recrystallization Behavior of Hot-Deformed Austenite Reconstructed from EBSD Orientation Maps of Lath Martensite
p.2389

Superplasticity of Friction-Stir Welded Al-Mg-Sc Alloy with Ultrafine-Grained Microstructure Obtained by Warm Severe Plastic Deformation
p.2395

Complex Nano-Scale Structures for Unprecedented Properties in Steels
p.2401

HomeMaterials Science ForumMaterials Science Forum Vol. 879Tensile and Fatigue Properties of Miniature Size...

Tensile and Fatigue Properties of Miniature Size Specimens of Sn-5Sb Lead-Free Solder

Abstract:

Tensile and low cycle fatigue properties of Sn-5Sb (mass%) solder were investigated with miniature size tensile specimens. The effect of temperature and strain rate on tensile properties and the effect of temperature on low cycle fatigue properties were examined. Tensile strength increases with increasing strain rate regardless of temperature investigated. For elongation, the effect of temperature on it is negligible although it slightly increases with increasing strain rate. The low cycle fatigue life of Sn-5Sb obeys by the Manson-Coffin’s equation. The effect of temperature on the fatigue life is negligible in the temperature range from 25 ^oC to 150 ^oC. In the low cycle fatigue test with a high total strain range of 4%, cracking at phase boundary mainly occurs regardless of temperature investigated. In the case of a low total strain range of 0.4%, ductile fracture mainly occurs, and cracking at phase boundary with generation of grooves also occurs at high temperature.

You might also be interested in these eBooks

View Preview

Info:

Periodical:

Materials Science Forum (Volume 879)

Pages:

2377-2382

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.879.2377

Citation:

Cite this paper

Online since:

November 2016

Authors:

Kyosuke Kobayashi, Ikuo Shohji, Hiroaki Hokazono

Keywords:

Lead-Free Solder, Low-Cycle Fatigue, Microstructure, Miniature Size Specimen, Sn-5Sb, Tensile Properties

Export:

RIS, BibTeX

Price:

Permissions:

Request Permissions

References

[1] M. Nahavandi, M. A. Azmah Hanim, Z. N. Ismarrubie, A. Hajalilou, R. Rohaizuan, M. Z. Shahrul Fadzli, Effects of silver and antimony content in lead-free high-temperature solders of Bi-Ag and Bi-Sb on copper substrate, Journal of Electronic Materials 43 (2014).

DOI: 10.1007/s11664-013-2873-8

Google Scholar

[2] R. I. Rodriguez, R. Puerto, D. Ibitayo, P. O. Quintero, Thermal stability characterization of the Au-Sn bonding for high-temperature applications, IEEE Trans-CPMT-A 3 (2013) 549-557.

DOI: 10.1109/tcpmt.2013.2243205

Google Scholar

[3] M. A. A. M. Salleh, A. M. M. A. Bakri, M. H. Z. Hazizi, F. Somidin, N. F. M. Alui, Z. A. Ahmad, Mechanical properties of Sn-0. 7Cu/Si3N4 lead-free composite solder, Materials Science and Engineering A - Structural Materials Properties Microstructure and Processing 3 (2012).

DOI: 10.1016/j.msea.2012.07.039

Google Scholar

[4] A. A. El-Daly, A. Fawzy, A. Z. Mohamad, A. M. El-Taher, Microstructural evolution and tensile properties of Sn-5Sb solder alloy containing small amount of Ag and Cu, Journal of Alloys and Compounds 509 (2011) 4574-4582.

DOI: 10.1016/j.jallcom.2011.01.109

Google Scholar

[5] V. Chidambaram, J. Hattel, J. Hald, High-temperature lead-free solder alternatives, Microelectronic Engineering 88 (2011) 981-989.

DOI: 10.1016/j.mee.2010.12.072

Google Scholar

[6] A. A. El-Daly, Y. Swilem, A. E. Hammad, Creep properties of Sn-Sb based lead-free solder alloys, Journal of Alloys and Compounds 471 (2009) 98-104.

DOI: 10.1016/j.jallcom.2008.03.097

Google Scholar

[7] Y. Kariya, T. Niini, T. Suga, M. Otsuka, Isothermal fatigue properties of Sn-Ag-Cu alloy evaluated by micro size specimen, Materials Transactions 46 (2005) 2309-2315.

DOI: 10.2320/matertrans.46.2309

Google Scholar

[8] I. Shohji, T. Osawa, T. Matsuki, Y. Kariya, K. Yasuda, T. Takemoto, Effect of specimen size and aging on tensile properties of Sn-Ag-Cu lead-free solders, Materials Transactions 49 (2008) 1175-1179.

DOI: 10.2320/matertrans.mbw200705

Google Scholar

[9] I. Shohji, Y. Toyama, Effect of strain rate on tensile properties of miniature size specimens of several lead-free alloys, Materials Science Forum 783-786 (2014) 2810-2815.

DOI: 10.4028/www.scientific.net/msf.783-786.2810

Google Scholar

[10] T. B. Massalski, Binary alloy phase diagrams, ASM International, New York, 1990, p.3306.

Google Scholar