Measurement of Residual Stresses in Thin Films by Two-Dimensional XRD

Bob B. He

doi:10.4028/www.scientific.net/MSF.524-525.613

Paper Titles

Characterisation of Residual Stresses in Machined Surfaces of a High Strength Nickel-Base Superalloy
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Residual Stresses Gradient Determination in Cu Thin Films
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X-Ray Diffraction Analysis of Nonuniform Residual Stress Fields σii(τ) under Difficult Conditions
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Residual Stress Gradients in PVD-Coated Carbide Cutting Tools
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Measurement of Residual Stresses in Thin Films by Two-Dimensional XRD
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Residual Stress Evolution during Decomposition of Ti_(1-x)Al_(x)N Coatings Using High-Energy X-Rays
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A Comparative Study of Microstructure and Residual Stresses of CMT-, MIG- and Laser-Hybrid Welds
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Strain Scan and Texture of an Anhydrite-Dolomite Rock from the Piora-Syncline (Switzerland)
p.633

In Situ Neutron Diffraction Study on the Mechanical Behavior of an Ultra-Fine-Grained Steel
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HomeMaterials Science ForumMaterials Science Forum Vols. 524-525Measurement of Residual Stresses in Thin Films by...

Measurement of Residual Stresses in Thin Films by Two-Dimensional XRD

Abstract:

This paper introduces the recent progress in two-dimensional X-ray diffraction as well as its applications in residual stress analysis in thin films. The stress measurement with twodimensional x-ray diffraction can be done with low incident angle and is not limited to the peaks with high two-theta angles like the conventional method. When residual stresses of thin films are measured, a low incident angle is preferred to maximize the diffraction signals from the thin films surfaces instead of from the substrates and matrix materials. Since one stress measurement at one fixed incident angle is possible, stress gradients in depth can be measured by series of incident angles. Some experimental examples are given to show the stress measurement at low and fixed incident angle.

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Periodical:

Materials Science Forum (Volumes 524-525)

Pages:

613-618

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.524-525.613

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Online since:

September 2006

Authors:

Bob B. He

Keywords:

Residual Stress, Stress Gradient, Thin Film, X-Ray Diffraction (XRD)

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