Optimization and Application of NTC Thick Film Segmented Thermistors

Maria Vesna Nikolic; Obrad.S. Aleksic; Branka M. Radojcic; Miloljub D. Lukovic; Nenad Nikolic; Zorka Djuric

doi:10.4028/www.scientific.net/KEM.543.491

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HomeKey Engineering MaterialsKey Engineering Materials Vol. 543Optimization and Application of NTC Thick Film...

Optimization and Application of NTC Thick Film Segmented Thermistors

Abstract:

NTC thermistor paste for printing thermal sensors on alumina was formed of very fine Ni_0.5Cu_0.2Zn_1.0Mn_1.3O₄thermistor powder obtained by a combined mechanical activation/thermal treatment process, organic vehicle and glass frit. Sheet resistivity was measured using an R-test matrix and it was much lower than the value determined for pure nickel manganite thermistors. The thermistor exponential coefficient was calculated from the R[ diagram measured in the temperature range-30 to +120°C in a climatic chamber. Thick film segmented thermistors with reduced dimensions (optimized construction) were printed sequentially layer by layer, dried and fired at 850°C/10 min in air. Electrodes were printed of PdAg conductive and solderable paste. The samples obtained were characterized by electrical and thermal measurements. The obtained NTC segmented thermistors with reduced dimensions were applied in a thermal sensor for water flow in the water mains. It contained a cold thermistor for measuring input water temperature and a self-heating thermistor for measuring the dependence of water current on water flow rate at a set input voltage power. Initial measurements show that the thermal sensor system requires a low input voltage power making it much easier and safer for operation.

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Periodical:

Key Engineering Materials (Volume 543)

Pages:

491-494

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.543.491

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Online since:

March 2013

Authors:

Maria Vesna Nikolic, Obrad.S. Aleksic, Branka M. Radojcic, Miloljub D. Lukovic, Nenad Nikolic, Zorka Djuric

Keywords:

Cu, Heat Loss - Fluid Flow Sensing, Thermal Sensors, Thick Film NTC Thermistors, Zn Doped Nickel Manganite

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References

[1] S. Jagtap, S. Rane, S. Gosavi, D. Amalnerkar, Microelectron. Eng. Vol. 88 (2011) p.82.

Google Scholar

[2] A. Feteira: J. Am. Ceram. Soc. Vol. 92 (2009), p.967.

Google Scholar

[3] M. V. Nikolic, B. M. Radojcic, O. S. Aleksic, M. D. Lukovic, P. M. Nikolic, IEEE Sensors J. Vol. 11 (2011) p.1640.

DOI: 10.1109/jsen.2010.2103309

Google Scholar

[4] O. S. Aleksic, S. M. Savic, M. V. Nikolic, L. Sibinovski, M. D. Lukovic, Microelectron. Int. Vol. 26 (2009) p.30.

Google Scholar

[5] O. S. Aleksic, P. M. Nikolic, K. M. Paraskevopoulos, Microelectron. Int. Vol. 23 (2006) p.14.

Google Scholar

[6] S. Fritsch, J. Sarrias, M. Brieu, J. J. Couderc, J. L. Baudour, E. Snoeck, A. Rousset, Solid State Ionics, Vol. 109 (1998) p.229.

Google Scholar

[7] C. H. Zhao, B. Y. Wang, P. H. Yang, L. Winnubst, C. S. Chen, J. Eur. Ceram. Soc. Vol. 28 (2008) p.35.

Google Scholar

[8] R. Meitz, J. Mater. Sci. Vol. 35 (2000) p.4705.

Google Scholar

[9] K. Park, J. K. Lee, Scripta Materialia, Vol. 57 (2007) p.329.

Google Scholar

[10] J. M. Varghese, A. Seema, K. R. Dayas, J. Electroceram. Vol. 22 (2009) p.436.

Google Scholar

[11] H. M. Zhang, A. M. Chang, C. W. Peng, Microelectron. Eng. Vol. 88 (2011) p.2934.

Google Scholar

[12] O. S. Aleksic, B. M. Radojcic, R. M. Ramovic, Microelectron. Int. Vol. 24 (2007) p.27.

Google Scholar