Key Issues in Microscale Temperature Sensing with Thermocouple Array

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Abstract:

Precise local temperature measurement is important for research on failure analysis of integrated circuits, micro/nano-fluidics, chemistry reactions in confined geometry, biological and biochemical reactions, etc. Thermocouple arrays are believed powerful for local temperature sensing at the microscale with high spatial, temporal, and temperature resolutions. And, as a passive device, a thermocouple array can often be embedded in a complicated solid device, providing real-time temperature information of critical regions of the device. In this work, we will discuss in detail some key issues of temperature sensing at the microscale by using thermocouple arrays, in terms of material, fabrication, calibration, measurement, time-resolvable mapping, and potential application.

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29-34

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December 2011

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[1] J. Christofferson, K. Maize, Y. Ezzahri, J. Shabani, X. Wang, A. Shakouri: J. Electron. Packag. Vol. 130 (2008), 041101

Google Scholar

[2] P. R. N. Childs, J. R. Greenwood, and C. A. Long: Rev. Sci. Instrum. Vol. 71 (2000), p.2959

Google Scholar

[3] C. Meola and G. M. Carlomagno: Meas. Sci. Tech. Vol. 15 (2004), p. R27

Google Scholar

[4] A. G. McNamara: Rev. Sci. Instrum. Vol. 33 (1962), p.330

Google Scholar

[5] O. Nakabeppu and T. Suzuki: J. Therm. Anal. Cal. Vol. 69 (2002), p.727

Google Scholar

[6] J.-J. Park and M. Taya: Electron. Lett. Vol. 40 (2004), p.599

Google Scholar

[7] J.-J. Park and M. Taya: J. Electron. Packag. Vol. 127 (2004), p.286

Google Scholar

[8] J. Long, A. G. Klock, C. Zhou, S. O. Memik, and M. Grayson: 16th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), (2010).

Google Scholar

[9] H. X. Liu, W. Q. Sun, Q. Chen and S. Y. Xu: IEEE Elec. Dev. Lett. (2011), in press.

Google Scholar

[10] J. Long, S. O. Memik, G. Memik, and R. Mukherjee: ACM Trans. Archit. Code Op., Vol. 5, (2008), 9.

DOI: 10.1145/1400112.1400114

Google Scholar