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Design of Double-Sided Polishing Machine for Functional Crystal Substrate
Abstract:
Responding to the demand on the ultra-precision equipment for machining monocrystalline silicon, sapphire, zirconia ceramics and other large-size functional crystal substrates in the microelectronics and optoelectronics manufacturing, this study analyzes the current state-of-the-art of polishing technologies and the technical challenges to achieving high surface quality substrates. In this study, a planetary double-sided polishing machine is designed to solve the problem between achieving high polishing quality and efficiency. The machine is characterized by process stability, large polishing pressure and high polishing speed, etc. which is verified by polishing zirconia substrates with satisfactory results: material removal rate of 5 μm/h and the surface roughness Ra of 1 nm.
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Pages:
580-585
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Online since:
September 2014
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