Abstract
The influence of varying substrate temperature, N2 partial pressure, ion energy, and ion-to-Ti flux ratio on the texture development and mechanical properties of TiN is investigated in detail. We show that during low substrate temperature (Ts = 300 °C) reactive sputtering of TiN in a mixed Ar + N2 discharge a change from 111- to 001-oriented growth occurs when increasing the ion-to-Ti ratio Ji/JTi above 2.5 while using a low ion energy Ei of 30 eV. This texture change can be reversed to a 111-oriented growth by increasing the ion energy to 60 and 90 eV when using high ion-to-Ti ratios Ji/JTi of 2.5 and 9, without introducing strain. Thereby the hardness can be increased from ∼31 to 37 GPa with only minor changes in compressive stresses. Consequently, by defining the ion-to-Ti ratio and the ion energy during low substrate temperature reactive sputtering of TiN the texture development towards 111- or 001-oriented growth can be controlled. Based on previous studies and the texture development as a function of substrate temperature and N2-partial pressure, we propose that varying the ion-to-Ti ratio and the ion energy result in different N-terminated surfaces and hence different Ti-fluxes from 111- to 001-oriented grains and vice versa.
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