Abstract
The transition layer formed upon deposition of Ni-Al coatings onto the surface of Cu substrates by using the technique of mechanical treatment followed by annealing was found to contain α-(Cu,Ni) solid solution, Cu9Al4, Ni3Al, NiAl, Ni2Al3, and NiAl3. The mechanism for formation of protective coating in the Ni-Al-Cu system was discussed.
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Sytschev, A.E., Busurin, S.M., Kovalev, D.Y. et al. Deposition of Ni-Al coatings onto copper by mechanical/heat treatment. Int. J Self-Propag. High-Temp. Synth. 22, 103–109 (2013). https://doi.org/10.3103/S1061386213020106
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DOI: https://doi.org/10.3103/S1061386213020106