Skip to main content
Log in

Deposition of Ni-Al coatings onto copper by mechanical/heat treatment

  • Published:
International Journal of Self-Propagating High-Temperature Synthesis Aims and scope Submit manuscript

Abstract

The transition layer formed upon deposition of Ni-Al coatings onto the surface of Cu substrates by using the technique of mechanical treatment followed by annealing was found to contain α-(Cu,Ni) solid solution, Cu9Al4, Ni3Al, NiAl, Ni2Al3, and NiAl3. The mechanism for formation of protective coating in the Ni-Al-Cu system was discussed.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Similar content being viewed by others

References

  1. Ternary Alloys: A Comprehensive Compendium of Evaluated Constitutional Data and Phase Diagrams, Petzow G. and Effenberg, G., Eds., New York: VCH, 1991.

    Google Scholar 

  2. Binary Alloy Phase Diagrams, Massalski, T.B., Ed., Metals Park, OH: ASM, 1986.

    Google Scholar 

  3. Fan, Q., Chai, H., and Jin, Z., Dissolution-precipitation-substitution mechanism for self-propagating high-temperature synthesis of β-NiAl(Cu)/α-(Cu,Ni) composite, Intermetallics, 2002, vol. 10, no. 6, pp. 541–554.

    Article  CAS  Google Scholar 

  4. Colin, J., Gonzalez, C., Herrera, R., and Juarez-Islas, J.A., Analysis of chill-cast NiAl intermetallic compound with copper additions, J. Mater. Eng. Perform., 2002, vol. 11, no. 5, pp. 487–491.

    Article  CAS  Google Scholar 

  5. Gale, W.F. and Abdo, Z.A.M., Bulk-alloy microstructural analogs for transient liquid-phase bonds in the NiAl/Cu/Ni system, Metall. Mater. Trans. A, 1999, vol. 30, no. 12, pp. 3111–3124.

    Article  Google Scholar 

  6. Gale, W.F. and Guan, Y., Transient liquid-phase bonding in the NiAl/Cu/Ni system: a microstructural investigation, Metall. Mater. Trans. A, 1996, vol. 27, no. 11, pp. 3621–3629.

    Article  Google Scholar 

  7. Roman’kov, S.E., Kaloshkin, S.D., and Pustov, L.Yu., Synthesis of titanium aluminide coatings on aluminum and titanium surfaces by mechanical alloying and subsequent annealing, Phys. Met. Metallogr., 2006, vol. 101, no. 1, pp. 58–65.

    Article  Google Scholar 

  8. Sytschev, A.E., Vadchenko, S.G., Gutmanas, E., and Kamynina, O.K., SHS joining of TiAl intermetallic with TiAl and NiAl via Al or Cu interlayer, Abstr. X Int. Symp. on SHS, Yerevan (Armenia), 2009, pp. 129–130.

    Google Scholar 

  9. Kovalev, D.Yu., Kochetov, N.A., and Ponomarev, V.I., Criteria for critical state of mechanoactivated Ni-Al system, Combust. Explos. Shock Waves, vol. 46, no. 4, pp. 457–463.

  10. Aluminum-copper-nickel, Landolt-Bönnstein: Group IV Physical Chemistry, Berlin-Heidelberg: Springer, 2005, vol. 11A2, pp. 1–23.

    Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to S. M. Busurin.

About this article

Cite this article

Sytschev, A.E., Busurin, S.M., Kovalev, D.Y. et al. Deposition of Ni-Al coatings onto copper by mechanical/heat treatment. Int. J Self-Propag. High-Temp. Synth. 22, 103–109 (2013). https://doi.org/10.3103/S1061386213020106

Download citation

  • Received:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.3103/S1061386213020106

Keywords

Navigation