2003 Volume 16 Issue 5 Pages 685-689
A new positive-working low-molecular-weight photoresist has been developed. The photoresist consisted of the matrix, tetra-C-methylcalix[4]resorcinarene (p-t-BM-C4-R) in which the OH groups were protected with tert-butoxycarbonylmethyl groups (protecting ratio: 27 ∼ 60%), and a photoacid generator (PAG), 5-(propylsulfonyloxyimino-5H-thiophen-2-ylidene)-2-methylphenyl-acetonitrile (PTMA). The p-t-BM-C4-R (protecting ratio: 40%) containing PTMA (2 wt%) showed a high sensitivity (10 mJ/cm2) and a contrast 11 after the irradiation with g-line, post-exposure baking at 120 °C at 60 sec, and developing with 2.38 wt% tetramethylammonium hydroxide aqueous solution (TMAHaq) at 20 °C for 10 sec.