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Print: ISSN 0914-4935
Online: ISSN 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
Online: ISSN 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
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Sensors and Materials
is covered by Science Citation Index Expanded (Clarivate Analytics), Scopus (Elsevier), and other databases.
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Sensors and Materials
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is covered by Science Citation Index Expanded (Clarivate Analytics), Scopus (Elsevier), and other databases.
Instructions to authors
English 日本語
Instructions for manuscript preparation
English 日本語
Template
English
Publisher
MYU K.K.
Sensors and Materials
1-23-3-303 Sendagi,
Bunkyo-ku, Tokyo 113-0022, Japan
Tel: 81-3-3827-8549
Fax: 81-3-3827-8547
MYU Research, a scientific publisher, seeks a native English-speaking proofreader with a scientific background. B.Sc. or higher degree is desirable. In-office position; work hours negotiable. Call 03-3827-8549 for further information.
MYU Research
(proofreading and recording)
MYU K.K.
(translation service)
The Art of Writing Scientific Papers
(How to write scientific papers)
(Japanese Only)
Sensors and Materials, Volume 29, Number 3 (2017)
Copyright(C) MYU K.K.
Copyright(C) MYU K.K.
|
pp. 217-223
S&M1313 Research Paper of Special Issue https://doi.org/10.18494/SAM.2017.1444 Published: March 15, 2017 Thermal Reactive Ion Etching of Minor Metals with SF6 Plasma [PDF] Gang Han, Yuki Murata, Yuto Minami, Masayuki Sohgawa, and Takashi Abe (Received August 1, 2016; Accepted January 30, 2017) Keywords: thermal reactive ion etching, minor metal, SF6 plasma, titanium
In this study, thermally assisted reactive ion etching (TRIE) was evaluated by both experiments and simulations. TRIE employs a self-heated stage instead of the etching stage of a regular RIE apparatus. The self-heated stage was designed on the base of the simulation results, and its heating characteristics upon the application of radio frequency (RF) power were evaluated. The temperature of the stage increases rapidly within 10 min because of the low thermal capacitance of the stage. An etch rate of 0.6 μm/min and an etch selectivity of about 30 were achieved for titanium etching with SF6 plasma. In addition, we also investigated the application of TRIE for various kinds of minor metals (Mo, Ta, Nb, and Ti alloy) for the first time and achieved higher etch rates and etch selectivities than those of regular RIE.
Corresponding author: Takashi Abe Cite this article Gang Han, Yuki Murata, Yuto Minami, Masayuki Sohgawa, and Takashi Abe, Thermal Reactive Ion Etching of Minor Metals with SF6 Plasma, Sens. Mater., Vol. 29, No. 3, 2017, p. 217-223. |
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