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ENHANCEMENT IN THERMO-HYDRAULIC PERFORMANCE OF MICROCHANNEL HEAT SINK WITH SECONDARY FLOWS OF LEAF VENATION PATTERN

Year 2020, Volume: 6 Issue: 5, 677 - 696, 01.10.2020

Vinayak Gaıkwad Suhas Mohıte Swapnil Shınde Mahesh Dherange

https://doi.org/10.18186/thermal.790258
Cited By: 3

Abstract

A new microchannel heat sink (MCHS) design comprising of secondary channels which connect neighboring primary channels are numerically analyzed to study their thermo-hydraulic characteristics. The inclusion of secondary channels in the continuous walls results in disturbance of thermal and hydrodynamic boundary layers which leads to drop in boundary layer thickness. Number of such secondary channel on either side of main channel will cause the flow to be continuously in developing state. The new MCHS are tested for heat flux range of 65 Watt per sq.cm to 200 Watt per sq.cm and cooled by water flowing at Reynolds number ranging from 650 to 1300. Compared to conventional MCHS, the thermal performance of new MCHS is higher but at the cost of pressure drop. The overall enhancement factor of the new design which is a function of Nusselt number and pressure drop of enhanced MCHS and conventional MCHS is 1.4 to 1.85.

Keywords

Microchannel Primary channel Secondary flow Enhancement factor

References

  • [1] D. B. Tuckerman and R. F. W. Pease, “High-performance heat sinking for {VLSI},” {IEEE} Electron Device Lett., vol. 2, no. 5, pp. 126–129, May 1981.
  • [2] M. Steinke and S. Kandlikar, “Review of single-phase heat transfer enhancement techniques for application in microchannels, minichannels and microdevices,” Int. J. Heat Technol., vol. 22, pp. 3–11, 2004.
  • [3] L. Chai, G. Xia, M. Zhou, J. Li, and J. Qi, “Optimum thermal design of interrupted microchannel heat sink with rectangular ribs in the transverse microchambers,” Appl. Therm. Eng., vol. 51, no. 1–2, pp. 880–889, Mar. 2013.
  • [4] G. Xie, F. Zhang, B. Sundén, and W. Zhang, “Constructal design and thermal analysis of microchannel heat sinks with multistage bifurcations in single-phase liquid flow,” Appl. Therm. Eng., vol. 62, no. 2, pp. 791–802, Jan. 2014.
  • [5] H. Shen, C.-C. Wang, and G. Xie, “A parametric study on thermal performance of microchannel heat sinks with internally vertical bifurcations in laminar liquid flow,” Int. J. Heat Mass Transf., vol. 117, pp. 487–497, Feb. 2018.
  • [6] J. Lan, Y. Xie, and D. Zhang, “Flow and Heat Transfer in Microchannels With Dimples and Protrusions,” J. Heat Transfer, vol. 134, no. 2, p. 21901, 2012.
  • [7] Y. Jia, G. Xia, Y. Li, D. Ma, and B. Cai, “Heat transfer and fluid flow characteristics of combined microchannel with cone-shaped micro pin fins,” Int. Commun. Heat Mass Transf., vol. 92, pp. 78–89, Mar. 2018.
  • [8] P. Li, Y. Luo, D. Zhang, and Y. Xie, “Flow and heat transfer characteristics and optimization study on the water-cooled microchannel heat sinks with dimple and pin-fin,” Int. J. Heat Mass Transf., vol. 119, pp. 152–162, Apr. 2018.
  • [9] V. S. Duryodhan, A. Singh, S. G. Singh, and A. Agrawal, “Convective heat transfer in diverging and converging microchannels,” Int. J. Heat Mass Transf., vol. 80, pp. 424–438, Jan. 2015.
  • [10] S. Soleimanikutanaei, E. Ghasemisahebi, and C.-X. Lin, “Numerical study of heat transfer enhancement using transverse microchannels in a heat sink,” Int. J. Therm. Sci., vol. 125, pp. 89–100, Mar. 2018.
  • [11] Y. F. Li, G. D. Xia, D. D. Ma, Y. T. Jia, and J. Wang, “Characteristics of laminar flow and heat transfer in microchannel heat sink with triangular cavities and rectangular ribs,” Int. J. Heat Mass Transf., vol. 98, pp. 17–28, Jul. 2016.
  • [12] N. R. Kuppusamy, R. Saidur, N. N. N. Ghazali, and H. A. Mohammed, “Numerical study of thermal enhancement in micro channel heat sink with secondary flow,” Int. J. Heat Mass Transf., vol. 78, pp. 216–223, Nov. 2014.
  • [13] Y. J. Lee, P. S. Lee, and S. K. Chou, “Enhanced Thermal Transport in Microchannel Using Oblique Fins,” J. Heat Transfer, vol. 134, no. 10, p. 101901, 2012.
  • [14] I. A. Ghani et al., “Heat transfer enhancement in microchannel heat sink using hybrid technique of ribs and secondary channels,” Int. J. Heat Mass Transf., vol. 114, pp. 640–655, Nov. 2017.
  • [15] V. Yadav, K. Baghel, R. Kumar, and S. T. Kadam, “Numerical investigation of heat transfer in extended surface microchannels,” Int. J. Heat Mass Transf., vol. 93, pp. 612–622, Feb. 2016.
  • [16] S. A. Zunaid Mohammad, Jindal A, Gakhar D, “Numerical study of pressure drop and heat transfer in a straight rectangular and semi cylindrical projections microchannel heat sink,” J. Therm. Eng., vol. 3, no. 5, pp. 1453–1465, Sep. 2017.
  • [17] R. S. Belhadj, Abdelkadir, R. Bouchenafa, “A numerical study of forced convective flow in microchannels heat sinks with periodic expansion-constriction cross section,” J. Therm. Eng., pp. 1912–1925, Mar. 2018.
  • [18] C. A. Rubio-Jimenez, S. G. Kandlikar, and A. Hernandez-Guerrero, “Performance of Online and Offset Micro Pin-Fin Heat Sinks With Variable Fin Density,” {IEEE} Trans. Components, Packag. Manuf. Technol., vol. 3, no. 1, pp. 86–93, Jan. 2013.
  • [19] X. Q. Wang, P. Xu, A. S. Mujumdar, and C. Yap, “Flow and thermal characteristics of offset branching network,” Int. J. Therm. Sci., vol. 49, no. 2, pp. 272–280, 2010.
  • [20] Frank P. Incropera, Liquid Cooling of electronic devices by single phase convection. John Wiley & Sons, 1999.
  • [21] P. S. Lee, S. V. Garimella, and D. Liu, “Investigation of heat transfer in rectangular microchannels,” Int. J. Heat Mass Transf., vol. 48, no. 9, pp. 1688–1704, 2005.
  • [22] M. E. Steinke and S. G. Kandlikar, “Single-phase liquid friction factors in microchannels,” Int. J. Therm. Sci., vol. 45, no. 11, pp. 1073–1083, Nov. 2006.
  • [23] R. L. Webb, “Performance evaluation criteria for use of enhanced heat transfer surfaces in heat exchanger design,” Int. J. Heat Mass Transf., vol. 24, no. 4, pp. 715–726, Apr. 1981.
  • [24] R. K. Shah, Laminar Flow Forced Convection in Ducts: A Source Book for Compact Heat Exchanger Analytical Data (Advances in Heat Transfer. Supplement). Academic Pr, 1978.
  • [25] L. Condra et al., “Terminology for use of parts outside manufacturer-specified temperature ranges,” {IEEE} Trans. Components Packag. Technol., vol. 22, no. 3, pp. 355–356, Sep. 1999.

Year 2020, Volume: 6 Issue: 5, 677 - 696, 01.10.2020

Vinayak Gaıkwad Suhas Mohıte Swapnil Shınde Mahesh Dherange

https://doi.org/10.18186/thermal.790258
Cited By: 3

Abstract

References

  • [1] D. B. Tuckerman and R. F. W. Pease, “High-performance heat sinking for {VLSI},” {IEEE} Electron Device Lett., vol. 2, no. 5, pp. 126–129, May 1981.
  • [2] M. Steinke and S. Kandlikar, “Review of single-phase heat transfer enhancement techniques for application in microchannels, minichannels and microdevices,” Int. J. Heat Technol., vol. 22, pp. 3–11, 2004.
  • [3] L. Chai, G. Xia, M. Zhou, J. Li, and J. Qi, “Optimum thermal design of interrupted microchannel heat sink with rectangular ribs in the transverse microchambers,” Appl. Therm. Eng., vol. 51, no. 1–2, pp. 880–889, Mar. 2013.
  • [4] G. Xie, F. Zhang, B. Sundén, and W. Zhang, “Constructal design and thermal analysis of microchannel heat sinks with multistage bifurcations in single-phase liquid flow,” Appl. Therm. Eng., vol. 62, no. 2, pp. 791–802, Jan. 2014.
  • [5] H. Shen, C.-C. Wang, and G. Xie, “A parametric study on thermal performance of microchannel heat sinks with internally vertical bifurcations in laminar liquid flow,” Int. J. Heat Mass Transf., vol. 117, pp. 487–497, Feb. 2018.
  • [6] J. Lan, Y. Xie, and D. Zhang, “Flow and Heat Transfer in Microchannels With Dimples and Protrusions,” J. Heat Transfer, vol. 134, no. 2, p. 21901, 2012.
  • [7] Y. Jia, G. Xia, Y. Li, D. Ma, and B. Cai, “Heat transfer and fluid flow characteristics of combined microchannel with cone-shaped micro pin fins,” Int. Commun. Heat Mass Transf., vol. 92, pp. 78–89, Mar. 2018.
  • [8] P. Li, Y. Luo, D. Zhang, and Y. Xie, “Flow and heat transfer characteristics and optimization study on the water-cooled microchannel heat sinks with dimple and pin-fin,” Int. J. Heat Mass Transf., vol. 119, pp. 152–162, Apr. 2018.
  • [9] V. S. Duryodhan, A. Singh, S. G. Singh, and A. Agrawal, “Convective heat transfer in diverging and converging microchannels,” Int. J. Heat Mass Transf., vol. 80, pp. 424–438, Jan. 2015.
  • [10] S. Soleimanikutanaei, E. Ghasemisahebi, and C.-X. Lin, “Numerical study of heat transfer enhancement using transverse microchannels in a heat sink,” Int. J. Therm. Sci., vol. 125, pp. 89–100, Mar. 2018.
  • [11] Y. F. Li, G. D. Xia, D. D. Ma, Y. T. Jia, and J. Wang, “Characteristics of laminar flow and heat transfer in microchannel heat sink with triangular cavities and rectangular ribs,” Int. J. Heat Mass Transf., vol. 98, pp. 17–28, Jul. 2016.
  • [12] N. R. Kuppusamy, R. Saidur, N. N. N. Ghazali, and H. A. Mohammed, “Numerical study of thermal enhancement in micro channel heat sink with secondary flow,” Int. J. Heat Mass Transf., vol. 78, pp. 216–223, Nov. 2014.
  • [13] Y. J. Lee, P. S. Lee, and S. K. Chou, “Enhanced Thermal Transport in Microchannel Using Oblique Fins,” J. Heat Transfer, vol. 134, no. 10, p. 101901, 2012.
  • [14] I. A. Ghani et al., “Heat transfer enhancement in microchannel heat sink using hybrid technique of ribs and secondary channels,” Int. J. Heat Mass Transf., vol. 114, pp. 640–655, Nov. 2017.
  • [15] V. Yadav, K. Baghel, R. Kumar, and S. T. Kadam, “Numerical investigation of heat transfer in extended surface microchannels,” Int. J. Heat Mass Transf., vol. 93, pp. 612–622, Feb. 2016.
  • [16] S. A. Zunaid Mohammad, Jindal A, Gakhar D, “Numerical study of pressure drop and heat transfer in a straight rectangular and semi cylindrical projections microchannel heat sink,” J. Therm. Eng., vol. 3, no. 5, pp. 1453–1465, Sep. 2017.
  • [17] R. S. Belhadj, Abdelkadir, R. Bouchenafa, “A numerical study of forced convective flow in microchannels heat sinks with periodic expansion-constriction cross section,” J. Therm. Eng., pp. 1912–1925, Mar. 2018.
  • [18] C. A. Rubio-Jimenez, S. G. Kandlikar, and A. Hernandez-Guerrero, “Performance of Online and Offset Micro Pin-Fin Heat Sinks With Variable Fin Density,” {IEEE} Trans. Components, Packag. Manuf. Technol., vol. 3, no. 1, pp. 86–93, Jan. 2013.
  • [19] X. Q. Wang, P. Xu, A. S. Mujumdar, and C. Yap, “Flow and thermal characteristics of offset branching network,” Int. J. Therm. Sci., vol. 49, no. 2, pp. 272–280, 2010.
  • [20] Frank P. Incropera, Liquid Cooling of electronic devices by single phase convection. John Wiley & Sons, 1999.
  • [21] P. S. Lee, S. V. Garimella, and D. Liu, “Investigation of heat transfer in rectangular microchannels,” Int. J. Heat Mass Transf., vol. 48, no. 9, pp. 1688–1704, 2005.
  • [22] M. E. Steinke and S. G. Kandlikar, “Single-phase liquid friction factors in microchannels,” Int. J. Therm. Sci., vol. 45, no. 11, pp. 1073–1083, Nov. 2006.
  • [23] R. L. Webb, “Performance evaluation criteria for use of enhanced heat transfer surfaces in heat exchanger design,” Int. J. Heat Mass Transf., vol. 24, no. 4, pp. 715–726, Apr. 1981.
  • [24] R. K. Shah, Laminar Flow Forced Convection in Ducts: A Source Book for Compact Heat Exchanger Analytical Data (Advances in Heat Transfer. Supplement). Academic Pr, 1978.
  • [25] L. Condra et al., “Terminology for use of parts outside manufacturer-specified temperature ranges,” {IEEE} Trans. Components Packag. Technol., vol. 22, no. 3, pp. 355–356, Sep. 1999.
There are 25 citations in total.

Details

Primary Language English
Subjects Engineering
Journal Section Articles
Authors

Vinayak Gaıkwad This is me 0000-0001-8627-0682

Suhas Mohıte This is me 0000-0002-3681-2284

Swapnil Shınde This is me 0000-0001-7920-779X

Mahesh Dherange This is me 0000-0002-6109-1853

Publication Date October 1, 2020
Submission Date November 16, 2018
Published in Issue Year 2020 Volume: 6 Issue: 5

Cite

APA Gaıkwad, V., Mohıte, S., Shınde, S., Dherange, M. (2020). ENHANCEMENT IN THERMO-HYDRAULIC PERFORMANCE OF MICROCHANNEL HEAT SINK WITH SECONDARY FLOWS OF LEAF VENATION PATTERN. Journal of Thermal Engineering, 6(5), 677-696. https://doi.org/10.18186/thermal.790258
AMA Gaıkwad V, Mohıte S, Shınde S, Dherange M. ENHANCEMENT IN THERMO-HYDRAULIC PERFORMANCE OF MICROCHANNEL HEAT SINK WITH SECONDARY FLOWS OF LEAF VENATION PATTERN. Journal of Thermal Engineering. October 2020;6(5):677-696. doi:10.18186/thermal.790258
Chicago Gaıkwad, Vinayak, Suhas Mohıte, Swapnil Shınde, and Mahesh Dherange. “ENHANCEMENT IN THERMO-HYDRAULIC PERFORMANCE OF MICROCHANNEL HEAT SINK WITH SECONDARY FLOWS OF LEAF VENATION PATTERN”. Journal of Thermal Engineering 6, no. 5 (October 2020): 677-96. https://doi.org/10.18186/thermal.790258.
EndNote Gaıkwad V, Mohıte S, Shınde S, Dherange M (October 1, 2020) ENHANCEMENT IN THERMO-HYDRAULIC PERFORMANCE OF MICROCHANNEL HEAT SINK WITH SECONDARY FLOWS OF LEAF VENATION PATTERN. Journal of Thermal Engineering 6 5 677–696.
IEEE V. Gaıkwad, S. Mohıte, S. Shınde, and M. Dherange, “ENHANCEMENT IN THERMO-HYDRAULIC PERFORMANCE OF MICROCHANNEL HEAT SINK WITH SECONDARY FLOWS OF LEAF VENATION PATTERN”, Journal of Thermal Engineering, vol. 6, no. 5, pp. 677–696, 2020, doi: 10.18186/thermal.790258.
ISNAD Gaıkwad, Vinayak et al. “ENHANCEMENT IN THERMO-HYDRAULIC PERFORMANCE OF MICROCHANNEL HEAT SINK WITH SECONDARY FLOWS OF LEAF VENATION PATTERN”. Journal of Thermal Engineering 6/5 (October 2020), 677-696. https://doi.org/10.18186/thermal.790258.
JAMA Gaıkwad V, Mohıte S, Shınde S, Dherange M. ENHANCEMENT IN THERMO-HYDRAULIC PERFORMANCE OF MICROCHANNEL HEAT SINK WITH SECONDARY FLOWS OF LEAF VENATION PATTERN. Journal of Thermal Engineering. 2020;6:677–696.
MLA Gaıkwad, Vinayak et al. “ENHANCEMENT IN THERMO-HYDRAULIC PERFORMANCE OF MICROCHANNEL HEAT SINK WITH SECONDARY FLOWS OF LEAF VENATION PATTERN”. Journal of Thermal Engineering, vol. 6, no. 5, 2020, pp. 677-96, doi:10.18186/thermal.790258.
Vancouver Gaıkwad V, Mohıte S, Shınde S, Dherange M. ENHANCEMENT IN THERMO-HYDRAULIC PERFORMANCE OF MICROCHANNEL HEAT SINK WITH SECONDARY FLOWS OF LEAF VENATION PATTERN. Journal of Thermal Engineering. 2020;6(5):677-96.

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