Abstract
Spontaneous deposition of copper seed layers from metal bearing organic based solutions onto sputter deposited titanium, titanium nitride, and tantalum diffusion barrier thin films has been demonstrated. Based on electrochemically driven cementation exchange reactions, the process was used to produce adherent, selectively deposited copper metal particulate films on blanket and patterned barrier metal thin films on silicon substrates. The organic solution deposited copper films were capable of acting as seed layers for subsequent electrolytic and electroless copper deposition processes using standard plating baths. Electroless and electrolytic copper films from 0.1µm to 1.0µm thick were produced on a variety of samples on which the organic solution copper acted as the initial catalytic seed layer. The feasibility of using organic solution deposited palladium as a seed layer followed by electroless copper deposition has also been demonstrated. In addition, experiments conducted on patterned barrier metal samples with exposed areas of dielectric such as polyimide indicated that no organic solution copper or palladium deposition occurred on the insulating materials.
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References
C. Ryu, K.-W. Kwon, A. L. S. Loke, H. Lee, T. Nogami, V. M. Dubin, R. A. Kavari, G. W. Way, and S. S. Wong, IEEE Transactions on Electron Devices 46(6), 1113 (1999).
R. D. Mikkola, Q.-T. Jiang, and B. Carpenter, Plating & Surface Finishing, March, 81 (2000).
V. Dubin and S.-D. Yosi, J. Electrochem. Soc. 44(3), 898 (1997).
T. J. O’Keefe, M. Stroder, M. J. O’Keefe in Advance Interconnects and Contact Materials and Processes for Future Integrated Circuits, ed. S. P. Murarka, D. B. Fraser, M. Eizenberg, R. Tung, R. Madar, Mater. Res. Soc. Proc. 514, 473, Warrendale, PA (1998).
T. J. O’Keefe, Method for Stripping Metals in Solvent Extraction, U. S. Patent #5,228,903, July 20, 1993.
L. M. Chia, M. P. Niera, C. Flores, and T. J. O’Keefe in Extraction and Processing for the Treatment and Minimization of Wastes, ed. J. P. Hager et al, TMS Annual Meeting, 279, Warrendale, PA (1994).
M. J. O’Keefe, K. D. Leedy, J. T. Grant, M. Fang, H. Gu, and T. J. O’Keefe, J. Vac. Sci. Tech. B 17(5), 2366 (1999).
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Gu, H., Fang, R., O’Keefe, T.J. et al. Organic Solution Deposition of Copper Seed Layers onto Barrier Metals. MRS Online Proceedings Library 612, 9191 (2000). https://doi.org/10.1557/PROC-612-D9.19.1
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DOI: https://doi.org/10.1557/PROC-612-D9.19.1