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Wetting Behaviors of Sn-Based Solders on Cu and Pd Surfaces

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Abstract

We have studied the surface morphology and wetting reaction of eutectic SnBi, eutectic SnPb, and pure Sn on Cu and Pd surfaces. In the case of Pd, the reactions were so fast that no quasi-equilibrium wetting angle could be measured. The compound formation has changed not only the interfaces but also the surfaces. Due to the formation of a reaction band outside the solder cap, the SnPb solder is no longer wetting the Cu surface but rather the Cu-Sn compound surface. In the wetting interface between eutectic SnPb and Cu, the morphology of the scallop-like Cu-Sn compound grains shows that we may not apply the classical model of layered compound growth to analyze the rate of soldering reactions.

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Authors and Affiliations

  1. Department of Materials Science and Engineering, University of California at Los Angeles, 90095-1595, Los Angeles, CA, USA

    H. K. Kim, Y. Wang & K. N. Tu

  2. Miniaturization Lab, Texas Inst. Inc., 76503-6102, Temple, TX, USA

    A. Maheshwari

Authors
  1. H. K. Kim
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  2. Y. Wang
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  3. A. Maheshwari
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  4. K. N. Tu
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Kim, H.K., Wang, Y., Maheshwari, A. et al. Wetting Behaviors of Sn-Based Solders on Cu and Pd Surfaces. MRS Online Proceedings Library 390, 183–188 (1995). https://doi.org/10.1557/PROC-390-183

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  • DOI: https://doi.org/10.1557/PROC-390-183

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