Abstract
Cu6Sn5 is a critical intermetallic compound in soldering operations. Conventional equilibrium phase diagrams show that this compound is of either a hexagonal or monoclinic structure at temperatures above and below 186 °C, respectively. Under nonequilibrium conditions, the crystal structure is dependent on composition, temperature, and processing history. The effect of Zn, Au, and In on the hexagonal to monoclinic polymorphic transformation in Cu6Sn5 intermetallics is investigated using variable temperature synchrotron powder x-ray diffraction and differential scanning calorimetry. It is revealed that, as in the case of trace Ni additions, the alloying elements Zn and Au completely stabilize the hexagonal Cu6Sn5 and prevent the phase transformation. In contrast, In additions only partially stabilize the hexagonal Cu6Sn5.
Similar content being viewed by others
References
K. Nogita, C.M. Gourlay, S.D. McDonald, Y.Q. Wu, J. Read, and Q.F. Gu: Kinetics of the ?–?’ transformation in Cu6Sn5. Scr. Mater. 65, 922 (2011).
K. Nogita: Stabilization of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys. Intermetallics 18, 145 (2010).
C.Y. Yu and J.G. Duh: Stabilization of hexagonal Cu6(Sn, Zn)5 by minor Zn doping of Sn-based solder joints. Scr. Mater. 65, 783 (2011).
G. Ghosh and M. Asta: Phase stability, phase transformations, and elastic properties of Cu6Sn5: Ab initio calculations and experimental results. J. Mater. Res. 20, 3102 (2005).
A.K. Larsson, L. Stenberg, and S. Lidin: Crystal structure modulations in ?-Cu5Sn4. Z. für Kristallographie 210, 832 (1995).
H. Okamoto: Phase Diagrams of Dilute Binary Alloys (ASM International, Materials Park, OH, 2002).
M. Li, Z. Zhang, and J. Kim: Polymorphic transformation mechanism of ? and ?’ in single crystalline Cu6Sn5. Appl. Phys. Lett. 98, 201901 (2011).
U. Schwingenschlögl, Di C. Paola, K. Nogita, and C.M. Gourlay: The influence of Ni additions on the relative stability of ? and ?’ Cu6Sn5. Appl. Phys. Lett. 96, 061908 (2010).
T. Laurila, V. Vuorinen, and M. Paulasto-Kröckel: Impurity and alloying effects on interfacial reaction layers in Pb-free soldering. Mater. Sci. Eng., R 68, 1 (2010).
Z. Luo, L. Wang, Q. Fu, C. Cheng, and J. Zhao: Formation of interfacial ?’-Cu6Sn5 in Sn–0.7Cu/Cu solder joints during isothermal aging. J. Mater. Res. 26, 1468 (2011).
D. Mu, J. Read, Y. Yang, and K. Nogita: Thermal expansion of Cu6Sn5 and (Cu, Ni)6Sn5. J. Mater. Res. 26, 2660 (2011).
C.Y. Chou and S.W. Chen: Phase equilibria of the Sn–Zn–Cu ternary system. Acta Mater. 54, 2393 (2006).
K. Nogita and T. Nishimura: Nickel-stabilized hexagonal (Cu, Ni)6Sn5 in Sn–Cu–Ni lead-free solder alloys. Scr. Mater. 59, 191 (2008).
K. Nogita, C. Gourlay, and T. Nishimura: Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates. JOM 61, 45 (2009).
K. Nogita, D. Mu, S.D. McDonald, J. Read, and Y.Q. Wu: Effect of Ni on phase stability and thermal expansion of Cu6-xNixSn5 (X = 0, 0.5, 1, 1.5 and 2). Intermetallics 26, 78 (2012).
S. Lidin and S.Y. Piao: The structure of Cu6Sn5-xSbx–Large effects of subtle doping. Z. für anorganische und allgemeine Chemie 635, 611 (2009).
F. Wang, X. Ma, and Y. Qian: Improvement of microstructure and interface structure of eutectic Sn–0.7 Cu solder with small amount of Zn addition. Scr. Mater. 53, 699 (2005).
F. Izumi and K. Momma: Three-dimensional visualization in powder diffraction. Solid State Phenom. 130, 15 (2007).
K.O. Lee, J.W. Morris, and F. Hua: Martensitic transformation in Sn-rich SnIn solder joints. J. Electron. Mater. 41, 336 (2011).
Acknowledgments
We gratefully acknowledge financial support from the University of Queensland-Nihon Superior collaborative research program. PXRD experiments were performed at the Australian Synchrotron Powder Diffraction Beamline (Project ID: AS121/PD/4524). The author thanks Mr. J. Read of The University of Queensland for valuable discussions and sample preparation; and the Queensland Node of the Australian National Fabrication Facility (ANFF-Q) at the University of Queensland for use of the DSC facility. G.Z. is financially supported by a University of Queensland International (UQI) Scholarship and a China Scholarship Council (CSC) Scholarship.
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Zeng, G., McDonald, S.D., Gu, Q. et al. Effect of Zn, Au, and In on the polymorphic phase transformation in Cu6Sn5 intermetallics. Journal of Materials Research 27, 2609–2614 (2012). https://doi.org/10.1557/jmr.2012.247
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1557/jmr.2012.247