Abstract
Electronic devices capable of performing in extreme mechanical conditions such as stretching, bending, or twisting will improve biomedical and wearable systems. The required capabilities cannot be achieved with conventional building geometries, because of structural rigidity and lack of mechanical stretchability. In this article, a zigzag-patterned structure representing a stretchable interconnect is presented as a promising type of building block. In situ experimental observations on the deformed interconnect are correlated with numerical analysis, providing an understanding of the deformation and failure mechanisms. The experimental results demonstrate that the zigzag-patterned interconnect enables stretchability up to 60% without rupture. This stretchability is accommodated by in-plane rotation of arms and out-of-plane deformation of crests. Numerical analysis shows that the dominating failure cause is interfacial in-plane shear stress. The plastic strain concentration at the arms close to the crests, obtained by numerical simulation, agrees well with the failure location observed in the experiment.
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References
V.J. Lumelsky, M.S. Shur, and S. Wagner: Sensitive skin. IEEE Sensors J. 1, 41 (2001).
S. Wagner, E. Bonderover, W.B. Jordan, and J.C. Sturm: Electro-textiles: Concepts and challenges. Int. J. Hielt Speed Electron. Syst. 12, 1 (2002).
H. Jiang, D.Y. Khang, J. Song, Y. Sun, Y. Huang, and J.A. Rogers: Finite deformation mechanics in buckled thin films on compliant supports. Proc. Nat. Acad. Sci. U.S.A. 104(40), 15607 (2007).
H. Jiang, Y. Sun, J.A. Rogers, and Y. Huang: Mechanics of precisely controlled thin film buckling on elastomeric substrate. Appl. Phys. Lett. 90, 133119 (2007).
H.C. Ko, M.P. Stoykovich, J. Song, V. Malyarchuk, W.M. Choi, C.J. Yu, J.B. Geddes, J. Xiao, S. Wang, Y. Huang, and J.A. Rogers: A hemispherical electronic eye camera based on compressible silicon optoelectronics. Nature 454, 748 (2008).
D.H. Kim, J.H. Ahn, W.M. Choi, H.S. Kim, T.H. Kim, J. Song, Y.Y. Huang, L. Zhuangjian, L. Chun, and J.A. Rogers: Stretch-able and foldable silicon integrated circuits. Science 320, 507 (2008).
J.H. Ahn, H.S. Kim, E. Menard, K.J. Lee, Z. Zhu, D.H. Kim, R.G. Nuzzo, J.A. Rogers, I. Amlani, V. Kushner, S.G. Thomas, and T. Duenas: Bendable integrated circuits on plastic substrates by use of printed ribbons of single-crystalline silicon. Appl. Phys. Lett. 90, 213501 (2007).
S.P. Lacour, S. Wagner, Z. Huang, and Z. Suo: Stretchable gold conductors on elastomeric substrates. Appl. Phys. Lett. 82(15), 2404 (2003).
S. Wagner, S.P. Lacour, J. Jones, P.I. Hsu, J.C. Sturm, T. Li, and Z. Suo: Electronic skin: Architecture and components. Physica E 25, 326 (2004).
T. Li, Z. Huang, Z. Suo, S.P. Lacour, and S. Wagner: Stretchabil-ity of thin metal films on elastomer substrates. Appl. Phys. Lett. 85(16), 3435 (2004).
T. Li, Z. Suo, S.P. Lacour, and S. Wagner: Compliant thin film patterns of stiff materials as platforms for stretchable electronics. J. Mater. Res. 20(12), 3274 (2005).
D.S. Gray, J. Tien, and C.S. Chen: High-conductive elastomeric electronics. Adv. Mater. 16(5), 393 (2004).
D. Brosteaux, F. Axisa, M. Gonzalez, and J. Vanfleteren: Design and fabrication of elastic interconnections for stretchable electronic circuits. IEEE Electron Device Lett. 28(7), 552 (2007).
M. Gonzalez, F. Axisa, Van der M. Bulcke, D. Brosteaux, B. Vandevelde, and J. Vanfleteren: Design of metal interconnects for stretchable electronic circuits. Microelectron. Reliab. 48, 825 (2008).
Y.Y. Hsu, M. Gonzalez, F. Bossuyt, F. Axisa, J. Vanfleteren, and I. DeWolf: A novel interconnect design with high stretchability and fine pitch capability in applications of stretchable electronics. Mater. Res. Soc. Symp. Proc. (2009).
S.L. Chiu, J. Leu, and P.S. Ho: Fracture of metal-polymer line structures. I: Semiflexible polyimide. J. Appl. Phys. 76(9), 5136 (1994).
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Hsu, YY., Gonzalez, M., Bossuyt, F. et al. In situ observations on deformation behavior and stretching-induced failure of fine pitch stretchable interconnect. Journal of Materials Research 24, 3573–3582 (2009). https://doi.org/10.1557/jmr.2009.0447
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DOI: https://doi.org/10.1557/jmr.2009.0447