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The Processing and Properties of Multilayer Interconnection Structures Using Thermoset Films Derived from Bisbenzocyclobutene.

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Abstract

Multilayer interconnection structures incorporating a novel polymeric dielectric derived from a bis-benzocyclobutene(bis-BCB) monomer have been fabricated. This paper discusses the processing conditions for the construction of these circuits and describes electrical characteristics of the dielectric layers. The relative dielectric constant of the BCB film was 2.7. Thermal cycling produced no significant change in the conductance of three level metal via chains through two layers of the polymer.

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References

  1. G. Messner, IEEE Trans. Components, Hybrids and Manufacturing Tech., CHMT-10, 143 (1987).

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  2. S. F. Hahn, P. H. Townsend, D. C. Burdeaux, and J. A. Gilpin, “The Fabrication and Properties of Thermoset Films Derived from Bisbenzocyclobutene for Multilayer Applications”, Proceedings of the ACS Division of Polymeric Materials: Science and Engineering, 59, 190, 1988.

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Authors and Affiliations

  1. The Dow Chemical Company, M. E. Pruitt Research Center, 1712 Building, Midland, MI, 48674, USA

    P. H. Townsend, D. C. Burdeaux, S. F. Hahn, M. Thomsen & J. N. Carr

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  1. P. H. Townsend
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  2. D. C. Burdeaux
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  3. S. F. Hahn
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  4. M. Thomsen
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  5. J. N. Carr
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Townsend, P.H., Burdeaux, D.C., Hahn, S.F. et al. The Processing and Properties of Multilayer Interconnection Structures Using Thermoset Films Derived from Bisbenzocyclobutene.. MRS Online Proceedings Library 154, 47–52 (1989). https://doi.org/10.1557/PROC-154-47

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  • DOI: https://doi.org/10.1557/PROC-154-47

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