Abstract
Molded interconnect devices offer great potential as a substitute for circuit boards, especially regarding three-dimensional shaping and functional integration. Applying circuits to polymer substrates can be performed by means of LPKF laser direct structuring® (LDS). There, the matrix polymer is filled with a special metal additive, enabling laser activation and subsequent metallization. Important effects emerge from additional inorganic fillers inside the matrix polymer, e.g. the (thermo)mechanical behavior and the processing properties. In this work, the degree to which inorganic fillers affect the quality of metallization is investigated. An increase in the plating thickness was successfully achieved by adding varying amounts of talc platelets (diameter 7 μm) to a PA10T-based copolyamide filled with 4 and 8 wt% LDS additive, in contrast to poor metal deposition adding only LDS additive. Additionally, talc and glass spheres with a diameter of 50 μm were used, leading to unsatisfactory metallization results. To explain this behavior, adhering LDS particles were found on the talc platelets with a diameter of 7 μm on the surface of the laser-structured specimen. The talc platelets and glass spheres of 50 μm were not available in sufficient dimensions on the surface and thus led to worse plating results.
Funding source: Allianz Industrie Forschung
Award Identifier / Grant number: IGF research project 16737 N
Funding statement: Allianz Industrie Forschung, (Grant/Award Number: “IGF research project 16737 N”).
Acknowledgments:
Parts of this research were carried out within the CORNET promotion plan (16737 N) from Research Association Molded Interconnect Devices 3-D MID e. V., which was funded by AiF within the program for sponsorship by Industrial Joint Research (IGF) of the German Federal Ministry of Economic Affairs and Energy based on enactment provision of the German parliament. Furthermore, the support from LPKF Laser & Electronics AG, Garbsen, Germany is greatly acknowledged for the structuring and metallization of the samples, as well as the assistance from Ensinger GmbH, Nufringen, Germany and Evonik Industries AG, Marl, Germany for supplying the materials. The authors are also grateful to the Institute for Factory Automation and Production Systems of FAU for providing their 3D laser scanning microscope.
Funding: Allianz Industrie Forschung, (Grant/Award Number: “IGF research project 16737 N”).
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