Abstract
The effect of two commercial melt strength enhancer additives, Paraloid BPMS-250 (BPMS) and Biostrength 700 (BIOS), on the thermal, rheological and morphological properties of polylactide (PLA) was studied. Thermal analyses showed that both the BPMS and BIOS additives decreased the ability of PLA to crystallize. The rheological tests indicated that zero-shear viscosity and storage modulus of the PLA/BPMS and PLA/BIOS blends were significantly increased with the additive content. These could be attributed to the entanglements between the PLA chains with those of the high molecular weight additive, creating a physical network which reduces the segmental mobility of PLA and improves the melt elasticity of the blend. The entanglement molecular weights (Me) of PLA/BPMS and PLA/BIOS blends were lower than those of unprocessed and processed PLA (Me≈4×104 g/mol), which suggests greater chain entanglements and a higher entanglement density (ve). The elongational viscosity (ηE) and melt strength values were estimated using a screw-extrusion capillary rheometer, where the PLA/BIOS blends presented the highest values. Finally, scanning electron microscopy on the samples was carried out to assess the blend morphology.
1 Introduction
In recent years one of the trends in the polymer field has been the replacement of traditional petroleum-derived plastics with biodegradable ones in order to diminish the waste disposal problems [1]. Polylactide (PLA) is a thermoplastic aliphatic polymer compostable and renewable [2]. It is a biocompatible [3] and economical material, compared with other biodegradable polymers, and its physical and mechanical properties are comparable to those of many petroleum-derived plastics [4]. However, PLA does not offer the processability needed for applications where stretching or drawing is involved like melt spinning, blow molding and blown film extrusion, due to its poor melt stability and low melt strength [5, 6]. The low melt strength of PLA, which is directly associated with its linear chain structure, tends to cause sagging and necking, reducing the processing throughput [7]. Moreover, during processing, the chain scission, due to hydrolysis and thermal instability, and the lactide formation by the back-biting mechanism, cause loss of molecular weight and viscosity [8–11]. The melt strength of a polymer is a measure of its resistance to extensional deformation and it is related to the molecular chain entanglements of the polymer and its resistance to untangling under strain. Recent studies describe the use of a single-screw extruder equipped with a capillary die and a Göttfert Rheotens melt strength tester [12–14] to measure out the plastics melt strength. The properties affecting the resistance to untangling are molecular weight, molecular weight distribution and molecular chain entanglements or branching of the polymer. As each property increases, the melt strength improves [15]. PLA needs to be melt-strengthened in order to enlarge its processing window and its range of applications. Many methods have been reported, such as increasing the molecular weight, broadening the relative molecular weight distribution, changing the molecular structure, the filling modification and blending modification [16]. Södergard and Stolt [17] presented a method to stabilize PLA using an organic peroxy compound (e.g., tert-butyl peroxybenzoate, dibenzoyl peroxide, tert-butyl peroxyacetate). Carlson et al. [18, 19] modified PLA using maleic anhydride and a range of alkoxy forming peroxides. Zhou et al. [20] obtained a copolymer prepared by chain extension of dicarboxylated PLLA and a diglycidyl ether of bisphenol-A (DGBA) based epoxy resin. Najafi et al. [21] prepared PLA-clay nanocomposites using polycarbodiimide, tris(nonyl phenyl) phosphate and Joncryl ADR-4368 as chain extenders. Liu et al. [16], Corre et al. [22], Mihai et al. [23] and Pilla et al. [24], employed a multi-functional epoxy-based chain extender (Cesa-Extend from Clariant) to give rise to branched structures of PLA. Recently, Han et al. [25] used polysilsesquioxane microspheres as novel chain extenders to improve the thermal stability of PLA. PLA has also been blended with different plasticizers, additives and/or polymers to improve desired properties [26–30]. Acrylic-based additives, so-called melt strength enhancers, have been designed to improve the melt strength and hence, the processability of PLA and its alloys. When added at levels as low as 2 wt% during thermal processing, it increases the melt elasticity of the blend. These additives protect the PLA from degradation and help the polymer chains to attenuate the loss of molecular weight and viscosity of the melt [31]. The entanglement of PLA chains with those of the high molecular weight acrylic creates a physical network with a high resistance to break in the melt [32]. However, to our knowledge there are no reports in the literature related with the incorporation of melt-strengthening commercial additives to PLA. The aim of this work was to assess the effect of the incorporation of two commercial melt strength enhancer additives on the thermal, rheological and morphological properties of PLA.
2 Materials and methods
2.1 Materials
NatureWorks (Minnetonka, MN, USA) semicrystalline PLA 4032D-grade comprising around 2% of D-lactic acid monomer was used (Table 1). It can be converted into a biaxially oriented film. The film has excellent optical properties, good machinability, excellent twist and dead fold properties and acts as a good barrier to flavor and grease and oil resistance [33]. The melt strength enhancer additives were Paraloid BPMS-250 (BPMS) provided by the Rhom and Haas Company (Philadelphia, PA, USA) [32] and Biostrength 700 (BIOS) from Arkema Inc. (King of Prussia, PA, USA) [34] derived from natural renewable sources. Typical properties are shown in Table 2. The formulation is proprietary; however, both additives are acrylic copolymers that have 60% or more of acrylic and/or methacrylic monomer units where acrylic monomers include methacrylates and/or acrylates. In addition, the acrylic copolymer can also include up to 40% of other ethylenically unsaturated monomers polymerizable with the acrylic monomers including, styrene, alpha-methyl styrene, vinyl acetate, vinylidene fluorides, vinylidene chlorides, acrylonitrile, vinyl sulfone, vinyl sulfides and vinyl sulfoxides [35]. All materials were dried overnight in a vacuum oven at 60°C before processing to remove moisture.
Material | MWa (g/mol) | Mna (g/mol) | MFlb (g/10 min) |
---|---|---|---|
Unprocessed | 164,840 | 90,280 | 8.7 |
Processed | 112,545 | 61,122 | 25.4 |
aDetermined by gel permeation chromatography (GPC).
bDetermined by melt flow indexer at 190°C and 2160 g.
Paraloid™ BPMS-250 | Biostrength® 700 | |
---|---|---|
Physical form | White powder | White powder |
Specific gravity | 1.19 | 1.17 |
Bulk density | 0.4–0.52 g/ml | 0.45 g/ml |
Particle size | – | 2% Maximum on 40 mesh |
Percent volatiles | – | 1.2% Maximum |
Melting point/range | 132–149°C | – |
Water solubility | Insoluble | Insoluble |
2.2 Blend preparation
PLA pellets were ground using a Brabender laboratory mill (Duisburg, Germany) into 1 mm particles before blending to make dispersion better. Table 3 summarizes the mixing composition of the PLA/BPMS and PLA/BIOS blends. Primarily, PLA and the melt strength enhancer were premixed by hand in a plastic container. Then, PLA blends were prepared by melt blended using a Brabender counter-rotating conical twin-screw extruder (Model CTSE-V, S. Hackensack, NJ, USA) with approximately 30:1 L/D ratio. The temperature profile along the extruder barrel was set at 165°C–175°C–180°C and 175°C (from feed zone to die), controlled with a Brabender temperature control console (Model 808-2503, S. Hackensack, NJ, USA). The screw speed was 40 rpm. The extruded strands were cut in a 2″ Brabender laboratory pelletizer (Model 12-72-000, S. Hackensack, NJ, USA). Finally, the pellets were conditioned for 4 h at 80°C under vacuum and kept sealed until ready to use.
Sample | PLA (wt%) | Paraloid™ BPMS-250 (wt%) | Biostrength® 700 (wt%) |
---|---|---|---|
Processed PLAa | 100.0 | 0 | 0 |
PLA/BPMS-2 | 98.0 | 2.0 | 0 |
PLA/BPMS-5 | 95.0 | 5.0 | 0 |
PLA/BPMS-10 | 90.0 | 10.0 | 0 |
PLA/BIOS-2 | 98.0 | 0 | 2.0 |
PLA/BIOS-5 | 95.0 | 0 | 5.0 |
PLA/BIOS-10 | 90.0 | 0 | 10.0 |
aExtruded PLA without melt strength enhancer additive.
2.3 Determination of thermal properties
The thermal properties were determined by differential scanning calorimetry (DSC) on a PerkinElmer Pyris Diamond DSC (Waltham, MA, USA) under a nitrogen atmosphere at a flow rate of 20 ml/min. In order to eliminate the influence of thermal history, all samples (about 5–8 mg sealed in aluminum pans) were first heated from room temperature up to 190°C and held at that temperature for 5 min, then cooled down to 45°C (i.e., 1st cooling) to record the crystallization temperature and finally heated again (i.e., 2nd heating). All the scanning rates for the DSC measurements were held at 10°C/min. Two repetitions were made for each formulation to ensure repeatability. Temperatures and enthalpies at glass transition, crystallization and melting were determined. The glass transition temperature (Tg) was recorded as the midpoint of the heat capacity change during the transition. The melting temperature (Tm) was recorded at the maximum of the enthalpy peak corresponding to the melting (ΔHm). The degree of crystallinity of the samples (Xc) was estimated from the heat evolved during crystallization according to the following equation:
where ΔHm, ΔHcc and
2.4 Determination of rheological properties
The melt flow index (g/10 min) was measured, using a Kayeness Galaxy I melt flow indexer (Model D7053, Morgantown, PA, USA) at standard conditions of 190°C under a load of 2160 g in accordance with ASTM D-1238 [37]. The reported melt index is an average of five samples. The dynamic oscillatory measurements were carried out on a rotational AR-2000 rheometer (TA Instruments, New Castle, DE, USA), equipped with parallel plates geometry, at 180°C. Primarily, sheets of all samples were prepared by compression molding at 170°C using a Carver hot press (Model 3891.4DI1A00, Wabash, IN, USA). Then, the compression molded samples of 1.0±0.1 mm thick were cooled to room temperature under ambient conditions and cut into 25 mm diameter discs. Frequency sweeps were carried out over an angular frequency ranging from 0.1 to 600 rad/s at a fixed strain of 10%. The gap distance between the parallel plates was 0.8 mm for all tests. The linear viscoelastic region was initially confirmed from a strain sweep test. Special care was taken to dry the samples for 24 h in a vacuum oven at 60°C prior to the rheological testing in order to avoid a significant decrease in viscosity. At least three repetitions of each dried formulation were made to ensure repeatability. The elongational viscosity was estimated from the Cogswell converging flow model [38]. The rheological properties necessary for the application of the model were measured by the screw-extrusion capillary rheometer in accordance with ASTM D-5422 [39] using a single-screw Brabender extruder (Model CTSE-V, S. Hackensack, NJ, USA) with 24:1 L/D ratio. The temperature profile was set at 160°C–170°C–180°C and 175°C at the die. The output end of the extruder was equipped with a capillary die (using the 2.0 mm insert series with 10, 15 and 20 L/D ratios), pressure transducer and a temperature sensor. The material was extruded through the capillary (for each insert) at different screw speeds from 15 to 60 rpm with increments of 15. The volumetric flow rate (Q) was calculated by weighing material collected over 2 min. A constant density of 1.12 g/cm3 was assumed. Each experiment was repeated in triplicate. The apparent shear viscosity η (Pa·s) was calculated using the following equations:
where τw is the corrected shear stress (Pa),
where ηE is the elongation viscosity (Pa·s), σE is the elongation stress (Pa),
2.5 Blend morphology
The morphology of the fracture surface of pure PLA and PLA/additive blends were characterized using a JEOL scanning electron microscope (SEM model JSM-6360LV, Peabody, MA, USA). The sample sheets were fractured after freezing in liquid nitrogen and sputter-coated uniformly with gold over all the fractured surfaces to enhance the conductivity prior to the SEM observations at an accelerating voltage of 20 kV.
3 Results and discussion
3.1 Thermal properties analysis
DSC measurements were conducted on PLA, PLA/BPMS and PLA/BIOS blends. The samples were preliminarily heated to 200°C to remove the thermal history and then, cooled at a rate of 10°C/min. During the cooling scans, none of the samples exhibited crystallization peak (Tc). This usually occurs because PLA crystallization is too slow to develop significant crystallinity. Several reviews have reported the low crystallization kinetics of PLA [41–43]. The second heating thermograms for the as received and processed PLA are shown in Figure 1. In both thermograms, an endothermic peak approximately at 60°C (representing excess enthalpy relaxation) is shown as the (Tg). For unprocessed neat PLA, a small peak at 170°C is observed and related to melting temperature with an enthalpy of 15.5 J g-1, while the cold crystallization peak could not be clearly observed. This might be because the unprocessed PLA does not have the ability to complete the crystallization process at the heating stage. The processed neat PLA exhibits a melting sharp peak at approximately 168°C and a defined cold crystallization peak at 100°C. In addition, the crystallinity of the processed PLA (Xc=28%) suggested that it increases during the extrusion when compared with unprocessed PLA (Xc=16%). The second heating thermogram for the PLA/BPMS and PLA/BIOS blends are shown in Figure 2, where only one Tg can be observed, suggesting the complete miscibility of the melt strength enhancer additive (either BPMS or BIOS) with PLA. Moreover, the PLA blends exhibited a similar thermal behavior regarding the Tg compared to the PLA without additive. The melting temperature of PLA/BPMS blends shifts to a lower temperature compared with the processed PLA. Double melting peaks appeared at about 163°C and 169°C in the PLA/BIOS blends and at 158°C and 155°C in the PLA/BPMS blends. This behavior has been reported as a result of a lamellar rearrangement during crystallization of PLA [44]. The peak at the lower temperature is related to the melting of the disordered α’ crystalline form, which can be produced by annealing at lower temperatures, and its recrystallization into the ordered α form, while the second peak corresponds to the melting of the crystal α form [44–46]. Cartier et al. [47] described the double melting peaks as a result of the difference of crystalline structure that can exist in PLA. The cold crystallization onset of the PLA blends shifts to higher temperatures, around 15°C, and enlarged the peak width as the mass fraction of BPMS or the BIOS additives increase. The increase of the cold crystallization temperature indicates that the crystallization has become more difficult [41]. Even for the blends containing the higher additive content (10 wt%), the cold crystallization peak was no longer visible, especially for the PLA/BPMS-10 sample. Since the crystallization is a process associated with partial alignment of the molecular chains, this behavior could be attributed to the entanglement between the additive chains with the PLA that reduce its chain mobility, so PLA chains did not have enough time to reorganize into stable crystals. The crystallinity (Xc) of the samples was calculated using Eq. (1). The PLA is expected to crystallize up to a maximum level of 40–45% which corresponds to 37–42 J/g endothermic peaks (using 93 J/g as the theoretical value for the heat of fusion of PLA crystals [48]). The values observed for all samples including the Tg, melting temperature (Tm), cold crystallization temperature (Tcc), melting enthalpy (ΔHm), cold crystallization enthalpy (ΔHcc) and associated degree of crystallinity (Xc) are presented in Table 4. As shown in this table, the percent of crystallinity decreased with an increase of the BPMS or BIOS additives. The PLA blends showed between 6% and 28% for the different melt strength enhancer contents examined. These results seem to indicate that the addition of the melt-strength enhancer diminishes the segmental movement of the PLA molecular chain changing its melting temperature and decreasing its ability to crystallize and/or recrystallize during processing.
Sample | Tg (°C) | Tcc (°C) | ΔHcc (J g-1) | Tm (°C) | ΔHm (J g-1) | Xc (%) | |
---|---|---|---|---|---|---|---|
1 | 2 | ||||||
Unprocessed PLA | 60 | – | – | – | 170 | 15.5 | 16.6 |
Processed PLA | 60 | 100 | 16 | – | 168 | 42.7 | 28.5 |
PLA/BPMS-2 | 60 | 114 | 29.8 | 148 | 155 | 49.3 | 21.4 |
PLA/BPMS-5 | 60 | 114 | 13.2 | 148 | 155 | 30.2 | 19.1 |
PLA/BPMS-10 | 60 | – | – | – | 153 | 5.1 | 6.1 |
PLA/BIOS-2 | 60 | 111 | 29.1 | 164 | 170 | 45.3 | 17.7 |
PLA/BIOS-5 | 60 | 114 | 16.6 | 163 | 169 | 30.5 | 15.6 |
PLA/BIOS-10 | 60 | 116 | 2.7 | 162 | 168 | 9.8 | 8.4 |
ΔHcc, enthalpy of cold crystallization; ΔHm, enthalpy of fusion; Tcc, cold crystallization temperature; Tg, glass transition temperature; Tm, melting temperature; Xc, degree of crystallinity.
3.2 Rheological properties
Dynamic rheological experiments were carried out at 180°C for the unprocessed and processed neat PLA, and the PLA/BIOS and PLA/BPMS blends. The viscoelastic properties were studied by measuring the storage modulus (G′), loss modulus (G″) and complex viscosity (η*) within the linear viscoelastic region (10% strain). The end of the linear viscoelastic region is indicated by a decrease of G′ value because G′ is the parameter which is most sensitive to changes in microstructure.
As shown in Figure 3, the complex viscosity of the samples decreases with increasing shear strain rate, acting as a pseudoplastic fluid. The unprocessed PLA exhibits a clear Newtonian Plateau at low frequencies with a zero-shear viscosity (η0) from around 2200 Pa·s and a shear thinning behavior at high oscillation frequency. The zero-shear viscosity was estimated from the Carreau model using the Rheoplus/32 V2.81 software as the viscosity value at very low shear rates or frequency approaching zero value (see Table 5). The processed neat PLA also exhibits a plateau region at low frequencies but with a lower zero-shear viscosity value compared with the unprocessed PLA (around 700 Pa·s). This could be attributed to degradation that suffers the PLA during its processing. Thermal degradation involves shortening molecular chains and therefore molecular weight loss leading to lower viscosities [49]. The characteristic relaxation time (τw) was calculated by taking the inverse of the crossover frequency defined as the frequency where G’ and G″ are equal (Table 5). The relaxation time is important because it provides a time scale that indicates how long is required to relax after a deformation or stress is applied [50]. Accordingly, the characteristic relaxation time, crossover frequency and zero shear viscosity are important viscoelastic properties of the polymer related to the degree of entanglement. A higher crossover frequency indicates lower entanglements among the molecules and a lower characteristic relaxation time [51].
Sample | η0 (Pa·s) | (105 Pa) | Me (104 g/mol) | τw (s) | MFl (g/10 min) | MS (%) |
---|---|---|---|---|---|---|
Unprocessed PLA | 2283 | 0.97 | 3.7 | 0.004 | 8.7 | -1 |
Processed PLA | 728 | 0.95 | 4.4 | 0.0016 | 25.4 | -48 |
PLA/BPMS-2 | 984 | 1.33 | 3.2 | 0.003 | 24.7 | 58 |
PLA/BPMS-5 | 1094 | 1.48 | 2.8 | 0.003 | 21.6 | 70 |
PLA/BPMS-10 | 1280 | 1.71 | 2.4 | 0.003 | 16.4 | 70 |
PLA/BIOS-2 | 1076 | 1.41 | 3.0 | 0.003 | 20.7 | 64 |
PLA/BIOS-5 | 1263 | 1.69 | 2.5 | 0.003 | 15.4 | 81 |
PLA/BIOS-10 | 1632 | 1.82 | 2.3 | 0.003 | 15.6 | 87 |
The curves of complex viscosity of PLA/BIOS and PLA/BPMS blends at various mass fractions of additive are presented in Figure 4. At low frequencies, PLA blends exhibit an indefinite plateau region, while the zero-shear viscosity values increase with increasing additive content. This enhancement of viscosity is due to greater entanglements between chains by adding higher quantity of melt strength enhancer additive, forming a network in which more PLA chains are anchored. This leads to reduced segmental mobility of PLA chains at low shear rates. At higher frequencies, PLA/BIOS and PLA/BPMS blends exhibit a shear thinning behavior where the complex viscosity decreases with increasing shear rate due to the PLA chains which are disentangled. It can be noted that the PLA blends containing BIOS additive exhibit higher viscosities.
The corresponding storage modulus (G′) and loss modulus (G″) are shown in Figures 5 and 6 for PLA/BPMS and Figures 7 and 8 for PLA/BIOS blends, respectively. At low frequencies, PLA blends also exhibit the rheological behavior characterized by a storage modulus G′ smaller than the loss modulus G″. The dynamic loss modulus G″ of PLA blends indicates that the blends with higher additive content have slightly higher G′ values than that of the processed PLA at low frequencies. This is because the addition of additive produced a material with more energy dissipation. At high frequencies, G″ becomes more insensitive to the network structure. At low frequencies, the storage modulus G′ increases with increasing additive content and PLA/BIOS blends exhibit the highest values, i.e., PLA/BIOS-10 has a storage modulus from around 100 Pa while processed PLA presents a value from around 0.5 Pa. This could be explained by the entanglements of PLA chains with the long additive chains creating a physical network where each chain is connected to all others by a sequence of knots to form a single macroscopic entity with higher melt elasticity. The melt strength is related to the elongational viscosity of the polymer, ηE, that is normally measured in a tensile test using an extensional rheometer. However, the difficulties encountered in using this type of rheometer led the researches to develop alternative experimental techniques [52]. In this work, the elongational viscosity of the unprocessed PLA and the PLA/BIOS and PLA/BPMS blends was determined from the Cogswell converging flow model [38]. The elongational viscosities as a function of elongation rate after Bagley correction for PLA/BIOS and PLA/BPMS blends are shown in Figures 9 and 10, respectively. The experiments were carried out by a screw-extrusion capillary rheometer. The elongational viscosity increased with the additive content (Paraloid BPMS-250 or Biostrength 700) as a result of greater entanglements between chains which leads to a high resistance to break in the melt during stretching. PLA/BIOS blends exhibited slightly greater results in comparison with PLA/BPMS blends, which could be because they have longer and heavier chains creating more entanglements, thus giving rise to a higher viscosity. So, the increase in elongation viscosity confirms the melt strengthening properties of PLA with the additive. An increase of the elongational properties also means a higher melt elasticity of entangled PLA compared with the unprocessed polymer. Figure 11 qualitatively illustrates the effect of addition of BIOS and BPMS melt strengthener additives to the PLA melt. The PLA melts encompassing additives are remarkably unbending and hold their shape better than the neat PLA. Usually, when a polymer increases its elongational viscosity, it exhibits strain hardening. Strain hardening has a positive effect on the sample deformation. When a strain hardening material is stretched, an inhomogeneity occurring somewhere in the sample will disappear as the larger elongation of the thinner cross section area leads to a higher elongational viscosity. Contrarily, for a non-strain hardening material, the sample will finally break by stretching [53]. Palade et al. [49] studied the elongational viscosity vs. time for PLA samples with different nominal L:D values at a rate of
where ρ(Kg/m3) is the density of the polymer at reference temperature T(K), R is the universal gas constant
In this work, estimations of the molecular weight between entanglements Me in the PLA melt were made. Accordingly, the plateau modulus
3.3 Blend morphology
The SEM micrographs of the PLA/BIOS and PLA/BPMS blends fracture surfaces are shown in Figure 12. Miscible blends are usually homogeneous and transparent, so we can see that both acrylic additives are homogenously dispersed in a continuous PLA phase. The fracture surface of neat PLA (Figure 12A) appeared relatively smooth, indicating a typical brittle fracture with no appreciable plastic deformation and a rapid propagation of the crack. In Figure 12B and C, it can be seen that the incorporation of 2 wt% of additives does not change the fracture mode of the blend compared with the neat PLA. By contrast, with 5 wt% and 10 wt% of acrylic additives, the mode of fracture of PLA blends changes to a more ductile one, indicating that both BIOS and BPMS additives acting like a PLA plasticizer, as can be seen in Figure 12D–G where rough and plastic deformation can be observed.
4 Conclusions
In order to find out the effect of two commercial melt strength enhancer additives on the thermal, rheological and morphological properties of PLA, different blends of PLA/additive were melt-blended using a screw extruder. Thermal analyses results showed the complete miscibility of the melt strength enhancer additive (either BPMS or BIOS) with PLA resin, since only one Tg was observed for all blends. The cold crystallization onset of the PLA blends shifts to higher temperatures and their crystallinity decreased with an increase of the BPMS or BIOS additives compared to neat PLA. This behavior indicates a lower crystallization capability of PLA in the blends, i.e., the addition of the melt-strength enhancer decreases the ability of PLA to crystallize and/or recrystallize during processing. The rheological tests indicated that zero-shear viscosity and storage modulus of the PLA/BPMS and PLA/BIOS blends were significantly increased with the additive content. The entanglement molecular weights (Me) of PLA/BPMS and PLA/BIOS blends were lower than those of unprocessed and processed neat PLA (Me≈4×104 g/mol), which suggests greater chain entanglements and a higher entanglement density (ve). The relaxation time τ of the PLA/BPMS blends is shorter than that of the PLA/BIOS blends, suggesting less entanglements and stronger mobility of the chain segments in the PLA/BPMS blends. The elongational viscosity and the melt strength of the blends increased with the additive content (Paraloid or BIOS). These findings suggest the entanglements of PLA chains with those of the high molecular weight additive, creating a physical network which reduces the segmental mobility of PLA and leads to a high resistance to break in the melt during stretching.
The analysis of SEM micrographs seems to confirm the miscibility of the acrylic additives with the PLA and suggests that they plasticize the PLA at 5% and 10% w/w content.
Acknowledgments
The authors would like to thank Ms. I.Q. Silvia Beatriz Andrade Canto for the SEM micrographs and Ms. M. en C. Maria Veronica Moreno Chulim for assistance with DSC characterization.
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