Abstract
Structuring of Cu deposits was reported to occur during electrodeposition in magnetic gradient fields, recently. This work aims on increasing the knowledge about the convection-induced structuring mechanism. Therefore, in-situ velocity measurements by Astigmatism Particle Tracking Velocimetry were performed. The information gained by this study is used to choose pulse-reverse-plating parameters suitable for deposition of separated Cu structures. Additionally, it is demonstrated that the structure shape can be changed by varying the superimposed magnetic field gradients. The structure height can be adjusted by the number of pulse-reverse-plating cycles. The structuring mechanism is discussed for potentiostatic as well as for pulse-reverse-plating conditions with respect to the acting magnetic forces.