Abstract
Spin‐on‐glass (SOG) has been characterized using process control techniques that provide in‐line monitoring capability. Film composition changes have been observed for different anneal temperatures (300°–1000°C) and ambients (oxygen and nitrogen). Fourier transform infrared (FTIR) spectroscopy and x‐ray photoelectron spectroscopy (XPS) show a reduction in organic content in the film after annealing at temperatures above 500°C. Area integration under the silicon dioxide peak in the FTIR spectrum indicates compositional changes begin at a critical temperature identified as approximately 500°C. Both FTIR and XPS data show further densification of SOG takes place at higher temperature anneals (700°– 1000°C). Refractive index and film stress measurement data correlate well with FTIR and XPS results.