Microcrystalline Silicon Film Deposition from  H 2 ‐ He ‐ SiH4 Using Remote Plasma Enhanced Chemical Vapor Deposition

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© 1998 ECS - The Electrochemical Society
, , Citation Sung‐Woo Lee et al 1998 J. Electrochem. Soc. 145 2900 DOI 10.1149/1.1838733

1945-7111/145/8/2900

Abstract

Microcrystalline silicon (μc‐Si:H) films were deposited at 250°C from the reaction of with gas excited in an inductively couple remote plasma. The deposition rate, microstructure, and material properties of μc‐Si:H depended on the composition of hydrogen and helium in the plasma. Si films deposited on a hydrogen plasma showed columnar and microcrystalline structure with a grain size of about 200 Å or less, and had an optical bandgap of about 2.05 to 2.1 eV. The microstructure parameter in the film) and Urbach tail slope decreased with increasing fraction in the plasma gas. On the other hand, amorphous (a‐Si:H) film was deposited with higher deposition rate when pure He was used as plasma gas and the optical bandgap of this film was 2.18 eV. The surface of a‐Si:H film was smoother than that of μc‐Si:H.

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10.1149/1.1838733