Abstract
Infrared spectra of multiple frustrated total internal reflection and transmission for silicon wafers obtained by direct bonding in a wide temperature range (200–1100°C) are studied. Properties of the silicon oxide layer buried at the interface are investigated in relation to the annealing temperature. It is shown that the thickness of the SiO2 layer increases from 4.5 to 6.0 nm as the annealing temperature is increased. An analysis of the optical-phonon frequencies showed that stresses in the SiO2 relax as the annealing temperature is increased. A variation in the character of chemical bonds at the interface between silicon wafers bonded at a relatively low temperature (20–400°C) is studied in relation to the chemical treatment of the wafers’ surface prior to bonding. Models of the process of low-temperature bonding after various treatments for chemical activation of the surface are suggested.
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Original Russian Text © A.G. Milekhin, C. Himcinschi, M. Friedrich, K. Hiller, M. Wiemer, T. Gessner, S. Schulze, D.R.T. Zahn, 2006, published in Fizika i Tekhnika Poluprovodnikov, 2006, Vol. 40, No. 11, pp. 1338–1348.
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Milekhin, A.G., Himcinschi, C., Friedrich, M. et al. Infrared spectroscopy of bonded silicon wafers. Semiconductors 40, 1304–1313 (2006). https://doi.org/10.1134/S1063782606110108
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DOI: https://doi.org/10.1134/S1063782606110108