Alternative smoothing techniques to mitigate EUV substrate defectivity

R. Teki; A. John Kadaksham; M. House; J. Harris-Jones; A. Ma; S. V. Babu; A. Hariprasad; P. Dumas; R. Jenkins; J. Provine; A. Richmann; J. Stowers; S. Meyers; U. Dietze; T. Kusumoto; T. Yatsui; M. Ohtsu; F. Goodwin

doi:10.1117/12.916497

22 March 2012 Alternative smoothing techniques to mitigate EUV substrate defectivity

R. Teki, A. John Kadaksham, M. House, J. Harris-Jones, A. Ma, S. V. Babu, A. Hariprasad, P. Dumas, R. Jenkins, J. Provine, A. Richmann, J. Stowers, S. Meyers, U. Dietze, T. Kusumoto, T. Yatsui, M. Ohtsu, F. Goodwin

Author Affiliations +

Proceedings Volume 8322, Extreme Ultraviolet (EUV) Lithography III; 83220B (2012) https://doi.org/10.1117/12.916497
Event: SPIE Advanced Lithography, 2012, San Jose, California, United States

Abstract

The majority of extreme ultraviolet (EUV) lithography mask blank defects originate from chemical mechanical polishing (CMP) of the substrate. The fact that CMP has not yet been able to yield EUV substrates with low defect counts highlights the challenges of polishing doped fused silica surfaces. Here we investigate alternative techniques based on processing either the substrate or coatings of amorphous silicon thin films and inorganic metal oxides. In particular, we evaluate a novel polymer-based non-abrasive a-Si CMP process, a photo-induced dry etching of substrate protrusions, a smoothing coat of spin-on or capillary coated Inpria metal oxide solution, CO2 laser polishing of the substrate surface, and annealing an a-Si thin film surface in reducing atmospheres. Although CMP still remains the best process with respect to overall process integration, these techniques have the potential to support CMP in solving the substrate defectivity issue and help pave the way to commercializing EUV mask blanks.

Citation Download Citation

R. Teki, A. John Kadaksham, M. House, J. Harris-Jones, A. Ma, S. V. Babu, A. Hariprasad, P. Dumas, R. Jenkins, J. Provine, A. Richmann, J. Stowers, S. Meyers, U. Dietze, T. Kusumoto, T. Yatsui, M. Ohtsu, and F. Goodwin "Alternative smoothing techniques to mitigate EUV substrate defectivity", Proc. SPIE 8322, Extreme Ultraviolet (EUV) Lithography III, 83220B (22 March 2012); https://doi.org/10.1117/12.916497

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available