High resolution negative i-line resist and process for metal lift-off applications

Medhat A. Toukhy; Salem K. Mullen; Ping-Hung Lu; Mark Neisser

doi:10.1117/12.474287

24 July 2002 High resolution negative i-line resist and process for metal lift-off applications

Medhat A. Toukhy, Salem K. Mullen, Ping-Hung Lu, Mark Neisser

Proceedings Volume 4690, Advances in Resist Technology and Processing XIX; (2002) https://doi.org/10.1117/12.474287
Event: SPIE's 27th Annual International Symposium on Microlithography, 2002, Santa Clara, California, United States

Abstract

A newly developed, high resolution negative i-line resist product family, is introduced in this paper. Variation in resist film absorption provides optimum inverted sidewall slopes adequate for most metal lift-off applications. Resist resolution below 0.3micrometers is demonstrated. The capability of further resolution enhancement with the use of a simple shrink process is also demonstrated.

Citation Download Citation

Medhat A. Toukhy, Salem K. Mullen, Ping-Hung Lu, and Mark Neisser "High resolution negative i-line resist and process for metal lift-off applications", Proc. SPIE 4690, Advances in Resist Technology and Processing XIX, (24 July 2002); https://doi.org/10.1117/12.474287

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