Temperature-dependent Si29 incorporation during deposition of highly enriched Si28 films

K. J. Dwyer, H. S. Kim, D. S. Simons, and J. M. Pomeroy
Phys. Rev. Materials 1, 064603 – Published 16 November 2017

Abstract

In this study, we examine the mechanisms leading to Si29 incorporation into highly enriched Si28 films deposited by hyperthermal ion beams at elevated temperatures in the dilute presence of natural abundance silane (SiH4) gas. Enriched Si28 is a critical material in the development of quantum information devices because Si28 is free of nuclear spins that cause decoherence in a quantum system. We deposit epitaxial thin films of Si28 enriched in situ beyond 99.999 98% Si28 onto Si(100) using an ion-beam deposition system and seek to develop the ability to systematically vary the enrichment and measure the impact on quantum coherence. We use secondary ion mass spectrometry to measure the residual Si29 isotope fraction in enriched samples deposited from 250C up to 800 °C. The Si29 isotope fraction is found to increase from <1×106 at the lower temperatures, up to >4×106 at around 800 °C. From these data, we estimate the temperature dependence of the incorporation fraction s of SiH4, which increases sharply from about 2.9×104 at 500 °C to 2.3×102 at 800 °C. We determine an activation energy of 1.00(8) eV associated with the abrupt increase in incorporation and conclude that below 500 °C, a temperature-independent mechanism such as activation from ion collisions with adsorbed SiH4 molecules is the primary incorporation mechanism. Direct incorporation from the adsorbed state is found to be minimal.

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  • Received 28 July 2017

DOI:https://doi.org/10.1103/PhysRevMaterials.1.064603

©2017 American Physical Society

Physics Subject Headings (PhySH)

Quantum Information, Science & TechnologyCondensed Matter, Materials & Applied Physics

Authors & Affiliations

K. J. Dwyer

  • Department of Materials Science and Engineering, University of Maryland, College Park, Maryland 20740, USA National Institute of Standards and Technology, Gaithersburg, Maryland 20899-8423, USA

H. S. Kim

  • Department of Electrical and Computer Engineering, University of Maryland, College Park, Maryland 20740, USA and National Institute of Standards and Technology, Gaithersburg, Maryland 20899-8423, USA

D. S. Simons

  • National Institute of Standards and Technology, Gaithersburg, Maryland 20899-8371, USA

J. M. Pomeroy*

  • National Institute of Standards and Technology, Gaithersburg, Maryland 20899-8423, USA

  • *joshua.pomeroy@nist.gov

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Issue

Vol. 1, Iss. 6 — November 2017

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