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Charge transfer at aluminum-C60 interfaces in thin-film multilayer structures

A. F. Hebard, C. B. Eom, Y. Iwasa, K. B. Lyons, G. A. Thomas, D. H. Rapkine, R. M. Fleming, R. C. Haddon, Julia M. Phillips, J. H. Marshall, and R. H. Eick
Phys. Rev. B 50, 17740(R) – Published 15 December 1994
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Abstract

Thin-film multilayer structures with up to 20 repeat layers have been grown in a high-vacuum chamber by sequential deposition of aluminum (Al) and fullerene (C60) onto room-temperature substrates. The periodicity of the layers is confirmed by x-ray-diffraction and in situ resistance measurements. The presence of underlying layers of C60 reduces the critical thickness at which Al becomes conducting from ∼35 to ∼20 Å. In addition, there is a sudden increase in resistance that occurs when each Al layer is covered by a monolayer of C60. These observations, together with the measurement of a downward shift in frequency of a considerably broadened Raman-active Ag(2) pentagonal-pinch mode, imply that up to six electrons per C60 are transferred from the Al to the C60 layer. This demonstration of charge transfer across planar metal-C60 interfaces suggests that multilayers may be a useful vehicle for forming fullerene interface compounds in two-dimensional structures.

  • Received 30 August 1994

DOI:https://doi.org/10.1103/PhysRevB.50.17740

©1994 American Physical Society

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Vol. 50, Iss. 23 — 15 December 1994

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