A neon ion beam has been used to regrow epitaxially a ~1700-Å-thick amorphous surface layer in silicon on sapphire at low temperatures. The damaged layer was produced by implanting 80-keV silicon ions to a dose of $2\times {10}^{15}$ ions/${\mathrm{cm}}^2$ at room temperature. The channeling technique with 315-keV protons was used to investigate the depth distribution of the damage, and disorder depth profiles were extracted from the backscattering spectra using calculations based on multiplescattering theory. The epitaxial regrowth was quantitatively determined from the extracted profiles. Many of the parameters which influence the regrowth rate, such as dose, dose rate, target temperature, energy, and random or channeled direction for the annealing beam, were varied. The results were compared with energy deposition calculations which indicated strongly that the annealing rate depends on the energy deposited in elastic collisions by the annealing ion beam. A defect annealing model based on vacancy diffusion is discussed.

• Received 8 March 1984

DOI:https://doi.org/10.1103/PhysRevB.30.3629