Issue 29, 2023

Low thermal conductivity in Bi8CsO8SeX7 (X = Cl, Br) by combining different structural motifs

Abstract

Understanding the structure–property relationships of materials in order to supress thermal conductivity is crucial for developing efficient thermoelectric generators and thermal barrier coatings. Low thermal conductivity materials can often contain a single dominant phonon scattering mechanism. Here, we highlight how combining different structural features into one material can aid in the design and identification of new materials with low thermal conductivities. We synthesise two new mixed-anion materials, Bi8CsO8SeX7 (X = Cl and Br), with low thermal conductivities of 0.27(2) and 0.22(2) W m−1 K−1 respectively, measured along their c-axes at room temperature. The Bi8CsO8SeX7 materials possess a combination of bond strength hierarchies, Cs+ vacancies, and low frequency Cs+ rattling. These different features significantly inhibit phonon transport along different crystallographic directions. Due to sharp bond strength contrast between the van der Waals gaps and [Bi2O2]2+ layers, the Bi8CsO8SeX7 materials exhibit thermal conductivities <50% of the theoretical minimum when measured along the stacking direction. Conversely, the thermal conductivity associated with the ab-plane is reduced by Cs+ rattling when compared to the structurally and compositionally related BiOCl.

Graphical abstract: Low thermal conductivity in Bi8CsO8SeX7 (X = Cl, Br) by combining different structural motifs

Supplementary files

Article information

Article type
Paper
Submitted
17 Mar 2023
Accepted
30 Jun 2023
First published
30 Jun 2023
This article is Open Access
Creative Commons BY license

J. Mater. Chem. A, 2023,11, 15739-15748

Low thermal conductivity in Bi8CsO8SeX7 (X = Cl, Br) by combining different structural motifs

J. A. Newnham, Q. D. Gibson, T. Wesley. Surta, A. Morscher, T. D. Manning, L. M. Daniels, J. B. Claridge and M. J. Rosseinsky, J. Mater. Chem. A, 2023, 11, 15739 DOI: 10.1039/D3TA01630G

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