Issue 37, 2020, Issue in Progress
From the journal:

RSC Advances

Physical gels of poly(vinylamine) by thermal curing†

Thorsten Fischer, ORCID logo a   Jens Köhler,a   Martin Möller*ab  and  Smriti Singh ORCID logo *a  

* Corresponding authors

a DWI-Leibniz-Institute for Interactive Materials, e.V., RWTH Aachen University, Forckenbeckstraße 50, D-52074 Aachen, Germany
E-mail: singh@dwi.rwth-aachen.de

b A. N. Nesemeyanov Institute of Organoelement Compounds of Russian Academy of Sciences (INEOS RAS), Vavilova 28, 119991 Moscow, Russia

Abstract

Physical gels are a versatile class of materials which can find application in sensors, electrochemistry, biomedicine or rheological modifiers. Herein, we present a hydrogen-bonded physical gel which is based on the interaction between phenylcarbonate telechelic poly(ethylene glycol) (PEG-PC) and poly(vinyl amine-co-acetamide) (p(VAm-co-VAA)). The critical gelation concentration was found to be 10 wt% by rheology and NMR. UV-vis spectroscopy and dynamic light scattering reveal the formation of aggregates in the gel. Rheology and differential scanning calorimetry (DSC) was used to show the effect of thermal curing on the mechanical properties of the physical gel.

Graphical abstract: Physical gels of poly(vinylamine) by thermal curing

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Article information

DOI
https://doi.org/10.1039/D0RA01607A
Article type
Paper
Submitted
19 Feb 2020
Accepted
16 Apr 2020
First published
09 Jun 2020
This article is Open Access
Creative Commons BY-NC license

RSC Adv., 2020,10, 21933-21939

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Physical gels of poly(vinylamine) by thermal curing

T. Fischer, J. Köhler, M. Möller and S. Singh, RSC Adv., 2020, 10, 21933 DOI: 10.1039/D0RA01607A

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