* Corresponding authors

^a State Key Laboratory of Electronic Thin Film and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, P. R. China
E-mail: hainingji@uestc.edu.cn

^b Department of Electronic and Electrical Engineering, University College London, Torrington Place, London WC1E 7JE, UK

^c Institute of Fundamental and Frontier Science, University of Electronic Science and Technology of China, Chengdu 610054, P. R. China
E-mail: azarisyu@gmail.com, Zhimingwang@uestc.edu.cn