Abstract
The electrical applications of carbons and their composites are reviewed, with emphasis on applications that are relevant to industrial needs. The applications include electrical conduction, electrical contacts, electrodes, electromagnetic interference shielding, resistance heating, thermoelectricity, sensing, electrical switching, electronic devices and thermal pastes. The carbons include graphite, coke, carbon fibers, carbon filaments, carbon black and flexible graphite.
Similar content being viewed by others
References
K. Kinoshita, “Carbon” (Wiley, New York, NY, 1988) p. 405.
J. Lahaye, M. J. Wetterwald and J. Messiet J. Appl. Electrochem. 14 (1984) 545.
M. Dohzono, H. Katsuki and M. Egashira J. Electrochem. Soc. 137 (1989) 1255.
D. Kohler, J. Zabasajja, A. Krishnagopalan and B. Tatarchuk ibid. 137 (1990) 136.
J. Lahaye, M. J. Wetterwald and J. Messier J. Appl. Electrochem. 14 (1984) 117.
J. L. Weininger and C. R. Morelock J. Electrochem. Soc. 122 (1975) 116.
D. D. L. Chung, in “Applications of Submicron Diameter Carbon Filaments,” Nanostructured Carbon for Advanced Applications, edited by G. Benedek et al. (Kluwer, Netherlands, 2001), p. 331.
C. A. Frysz, X. Shui and D. D. L. Chung J. Power Sources 58(1) (1996) 41.
L. Weiming and D. D. L. Chung Carbon 40(ER3) (2002) 447.
C. A. Frysz, X. Shui and D. D. L. Chung J. Power Sources 58(1) (1996) 55.
C. A. Frysz, X. Shui Carbon 33(12) (1995) 1681.
S. Wilkening Erdol & Kohle Erdgas Petrochemie 39(12) (1986) 551.
R. Pangrazzi, W. H. Hartt and R. Kessler Corrosion 50(3) (1994) 186.
J. Hou and D. D. L. Chung Cem. Concr. Res. 27(5) (1997) 649.
G. H. Anderson, Cathodic Protection of a Bridge Deck with Silicon Iron Anodes and Coke Breeze Overlay, in Proc. Conf. on Cathodic Protection of Reinforced Concrete Bridge Decks. (NACE, Houston, Texas, USA, 1985) p. 82.
K. C. Clear, in Proc. Conf. on Cathodic Protection of Reinforced Concrete Bridge Decks (NACE, Houston, Texas, USA, 1985) p. 55.
J. J. Fontana and R. P. Webster Transp Res. Rec. 1041 (1985) 1.
V. Dunlap, Cathodic Protection System Selection, in Proc. Conf. on Cathodic Protection of Reinforced Concrete Bridge Decks (NACE, Houston, Texas, USA, 1985) p. 131.
R. F. Stratfull, Eleven Years of Success for Coke Breeze C. P. Pavement, in Proc. Conf. on Cathodic Protection of Reinforced Concrete Bridge Decks (NACE, Houston, Texas, USA, 1985) p. 66.
W. R. Schutt, Cathodic Protection Applied to Bridge Decks, in Proc. Conf. on Cathodic Protection of Reinforced Concrete Bridge Decks (NACE, Houston, Texas, USA, 1985) p. 46.
A. A. Gadallah, A. S. Noureldin, F. Ezzat and A. Osman Transp. Res. Rec. 968 (1984) 1.
M. M. Mateev and D. L. Totev Dautschuk & Gummi Kunststoffe 49(6) (1996) 427.
S. E. Artemenko, L. P. Nikulina, T. P. Ustinova, D. N. Akbarov, E. P. Krajnov and V. I. Dubkova Khimicheskie Volokna (4) (1992) 39.
J. E. Travis, Soc. Plastics Eng. 8th Annual Pacific Technical Conf. and Tech. Displays (Society of Plastics Engineers, Brookfield Center, CT, 1985) p. 98.
A. I. Medalia Rubber Chem. Tech. 59(3) (1986) 432.
Data Sheet, Controlled Resistivity Alumina for Static Charge Dissipation, WESGO Technical Ceramics, Belmont, CA.
A. V. Zemlyanukhin, V. D. Alekseev, T. V. Timofeeva and Y. V. Nikifirov, Steklo i Keramika (6) (1992) 21.
T. M. Zhdanova, A. V. Zemlyanukhin and S. N. Neumeecheva Glass Ceramics 48(3/4) (1991) 168.
T. M. Zhdanova, A. V. Zemlyanukhin, Steklo i Keramika (4) 1991 24.
P. O'shea Evaluation Eng. 36(2) (1997) 6.
S. Wen and D. D. L. Chung J. Electron Mater 30(11) (2001) 1448.
P.-W. Chen and D. D. L. Chung ACI Mater. J. 93(2) (1996) 129.
R. Brewer and G. Fenical, ShieldingEval. Eng. 37(7) (1998) S4–;;S10.
P. O'Shea Evaluation Eng. 37(6) (1998) 40,43,45.
S. Shinagawa, Y Kumagai and K Urabe J. Porous Mater. 6(3) (1999) 185.
J. Hajdu Trans. Inst. Metal. Finishing 75(pt. 1) (1997) B7.
N. V. Mandich Plat. Surf. Finish. 81(10) (1994) 60.
C. Nagasawa, Y. Kumagai, K. Urabe and S. Shinagawa J. Porous Mater. 6(3) (1999) 247.
S. L. Thompson Evaluation Eng. 37(7) (1998) 62,65.
D. A. Olivero and D. W. Radford J. Reinf. Plast. Comp. 17(8) (1998) 674.
K. P. Sau, T. K. Chaki, A. Chakraborty and D. Khastgir Plast. Rub. Comp. Proc. Appl. 26(7) (1997) 291.
C. Y. Huang and J. F. Pai J. Appl. Polym. Sci. 63(1) (1997) 115.
M. A. Saltzberg, A. L. Neller, C. S. Harvey, T. E. Borninski and R. J. Gordon Circuit World 22(3) (1996) 67.
J. Wang, V. V. Varadan and V. K. Varadan SAMPE J. 32(6) (1996) 18.
J. Joo, A. G. Macdiarmid and A. J. Epstein Proc. 53rd Annual Tech. Conf. 2 (1995) 1672.
P. Yam Sci. Amer. 273(1) (1995) 82.
H. H. Kuhn, A. D. Child and W. C. Kimbrell Synthetic Metals 71(1–;;3) (1995) 2139.
M. T. Nguyen and A. F. Diaz Adv. Mater. 6(11) (1994) 858.
S. H. Peng and K. Zhang, Finite Element Analysis Aided Engineering of Elastomeric EMI shielding Gaskets, in Proc. 1998 56th Annual Tech. Conf. (Society of Plastic Engineers, Brookfield, CT, 1998) Vol. 2, p. 1216.
S. K. Das, J. Nuebel and B. Zand, Investigation on the Sources of Shielding Degradation for Gaskets with Zinc Coated Steel Enclosures, in Proc. 1997 IEEE 14th International Symposium on Electromagnetic Compatibility (IEEE, Piscataway, NJ, 1997) p. 66.
S. H. Peng and W. S. V. Tzeng, Recent Developments in Elastomeric EMI Shielding Gasket Design, in Proc. 1997 International Symposium on Electromagnetic Compatibility (IEEE, Piscataway, NJ, 1997) p. 94.
P. O'shea Eval. Engng. 36(8) (1997) 6.
P. O'shea Eval. Engng. 35(8) (1996) 4.
P. B. Jana and A. K. Mallick J. Elast. Plast. 26(1) (1996) 58.
L. Li and D. D. L. Chung Composites 25(3) (1994) 215.
X. Shui and D. D. L. Chung J. Electron. Mater. 26(8) (1997) 928.
X. Fu and D. D. L. Chung Cem. Concr. Res. 26(10) (1997) 1467.
J.-M. Chiou, Q. Zheng and D. D. L. Chung Composites 20(4) (1989) 379.
X. Fu and D. D. L. Chung Carbon 36(4) (1998) 459.
J. Cao and D. D. L. Chung ibid. 41(12) (2003) 2433.
S. Wen and D. D. L. Chung Cem. Concr. Res. in press.
www.achesonindustries.com
J. Wu and D. D. L. Chung Carbon 41(6) (2003) 1313.
J. Cao and D. D. L. Chung Cem. Concr. Res. 33(11) (2003) 1737.
B. R. Chadha, D. P. Dobhal and L. R. Gupta Industr. Lubric. Tribol. 41(3) (1989) 4.
M. Tsukuda, K. Takada and K. Ozaki J. Jpn. Inst. Light Metals 29(9) (1979) 403.
B. Lee Silicone Rubber. Enging. 236(10) (1995) 32.
J. C. Roberts and P. D. Weinhold J. Comp. Mater. 29(14) (1995) 1834.
M. Choate and G. Broadbent, Toughened Phenolic SMC for EMI Shielding Applications, in Proc. 1996 Regional Tech. Conf. of the Society of Plastic Engineers (Society of Plastices Engineers, Brookfield, CT, 1996) p. 69.
P. D. Wienhold, D. S. Mehoke, J. C. Roberts, G. R. Seylar and D. L. Kirkbride, Electromagnetic Interference (EMI) Shielding Effectiveness, Surface Resistivity, and RF Conductivity of Thin Composites for Spacecraft Applications, in Proc. 1998 30th International SAMPE Tech. Conf. (SAMPE, Covina, CA, 1998) Vol. 30, p. 243.
A. Fernyhough and Y. Yokota Comp. IT. Mater. World 5(4) (1997) 202.
T. Hiramoto, T. Terauchi and J. Tomibe, Controlling ESD and Absorbing and Shielding EMW by Using Conductive Fiber in Aircraft, in Proc. 1998 20th Annual International EOS/ESD Symp. (Electrostatic Discharge Association, Rome, NY, 1998) p. 18.
L. G. Morin, Jr and R. E. Duvall, Applications for Copper and Nickel-Copper-Nickel Electroplated Carbon Fibers for EMI/RFI Shielding, in Proc. 1998 43rd International SAMPE Symp. and Exhib. (SAMPE, Covina, CA, 1998) Vol. 43,No. 1, p. 874.
J. R. Gaier, M. L. Davidson and R. K. Shively, Durability of Intercalated Graphite Epoxy Composites in Low Earth Orbit, in Proc. 1996 28th International SAMPE Tech. Conf. (SAMPE, Covina, CA, 1996) Vol. 28, p. 1136.
J. M. Liu, S. N. Vernon, A. D. Hellman and T. A. Campbell, Electromagnetic Nondestructive Evaluation of Composites for Navy Ship Applications, in Proc. SPIE—The International Society for Optical Engineering (Society of Photo-Optical Instrumentation Engineers, Bellingham, WA, 1995) Vol. 2459, p. 60.
D. A. Olivero and D. W. Radford, Integrating EMI Shielding into Composite Structure, in Proc. 1996 28th International SAMPE Tech. Conf. (SAMPE, Covina, CA, 1996) Vol. 28, p. 1110.
T. Okabe, K. Saito, H. Togawa and Y. Kumagai Zairyo/J. Soc. Mater. Sci., Japan 44(498) (1995) 288.
L. G. Morin, Jr and R. E. Duvall, in Proc. 1998 43rd International SAMPE Symp. and Exhib. (SAMPE, Covina, CA, 1998) Vol. 43,No. 1, p. 874.
J. R. Gaier and J. Terry, in Proc. 1994 7th International SAMPE Electronics Conf. (SAMPE, Covina, CA, 1994) Vol. 7, p. 221.
J. R. Gaier, M. L. Davidson and R. K. Shively, in Proc. 1996 28th International SAMPE Tech. Conf. on Technology Transfer in a Global Community (SAMPE, Covina, CA, 1996) Vol. 28, p. 1136.
J. M. Liu, S. N. Vernon, A. D. Hellman and T. A. Campbell, in Proc. of SPIE—The International Soc. for Optical Eng. (Society of Photo-Optical Instrumentation Engineering, Bellingham, WA, 1995) Vol. 2459, p. 60.
D. A. Olivero and D. W. Radford, in Proc. 1996 28th International SAMPE Tech. Conf. on Technology Transfer in a Global Community (SAMPE, Covina, CA, 1996) Vol. 28, p. 1110.
J. Wu and D. D. L. Chung Carbon 40(ER3) (2002) 445.
X. Luo and D. D. L. Chung ibid. 34(10) (1996) 1293.
A. Perkins and A. Guthrie Metallurgia 19(12) (1982) 605.
K. Ebeling Betonwerk und Fertigteil—Technik 60(12) (1994) 70.
F. Lazzari and G. Raffellini Intern. J. Amb. Energy 2(3) (1981) 141.
A. Kumar, U. Singh, A. Srivastava and G. N. Tiwari Appl. Energy 8(4) (1981) 255.
S. P. Seth, M. S. Sodha and A. K. Seth ibid. 10(2) (1982) 141.
N. D. Kaushik and S. K. Rao ibid. 12(1) (1982) 21.
A. H. Fanney, B. P. Dougherty and K. P. Dramp, Field Performance of Photovoltaic Solar Water Heating Systems, in Proc. 1997 International Solar Energy Conf. (ASME, New York, NY, 1997) p. 171.
K. Pelissier, T. Chartier and J. M. Laurent Ceram. Intern. 24(5) (1998) 371.
F. S. G. Dos Santos and J. W. Swart J. Electrochem. Soc. 137(4) (1990) 1252.
M. J. Cattelino, G. V. Miran and B. Smith IEEE Trans. Electr. Dev. 38(10) (1991) 2239.
C. C. Hung, M. E. Dillehay and M. Stahl J. Aircraft 24(10) (1987) 725.
J. Xie, J. Wang, X. Wang and H. Wang Hecheng Shuzhi Ji Suliao/Synthetic Resin & Plastics 13(1) (1996) 50.
C. Sandberg, W. Whitney, A. Nassar and G. Kuse, Intellignet Distributed Heater used for Industrial Applications, in Proc. 1995 IEEE International Conf. Systems, Man and Cybernetics (IEEE, Piscataway, NJ 1995) Vol. 4, p. 3346.
V. N. Prokushin, A. A. Shubin, V. V. Klejmenov and E. N. Marmer Khimicheskie Volkna (6) (1992) 50.
H. W. Long and G. E. Long, Asphaltic Compositions and Uses Therefor, U.S. Patent no. 6,193,793 (2001).
I. V. Avtonomov and G. A. Pugachev, Resistive Composite Material Based on an Alkaline Slag Binder, Izvestiya Sibirskogo Otdeleniya Akademii Nauk Sssr, Seriya Tekhnicheskikh Nauk (1987) Vol. 21, p. 110.
S. Yehia, C.Y. Tuan, D. Ferdon and B. Chen ACI Mater. J. 97(2) (2000) 172.
Y. Kasai Concr. Int: Design. Constr. 11(3) (1989) 33.
W. Nakagawa, K. Nishita and Y. Kasai, Stripping Demolition of Reinforced Concrete by Electric Heating Method, in Proc. 2nd ASME-JSME Nuclear Engineering Joint Conf. (ASME, New York, NY, 1993) p. 871.
F. S. Chute, F. E. Vermeulen and M. R. Cervenan Canadian Electr. Eng. J. 6(1) (1981) 20.
M. J. Cattelino, G. V. Miran and B. Smith IEEE Trans. Electr. Dev. 38(10) (1991) 2239.
C.-C. Hung, M. E. Dillehay and M. Stahl J. Aircraft 24(10) (1987) 725.
J. Xie, J. Wang, X. Wang and Hao Wang Hecheng Shuzhi Ji Suliao (Synthetic Resin & Plastics) 13(1) (1996) 50.
P. L. Zaleski, D. J. Derwin and W. H. Flood, Jr. Electrically Conductive Paving Mixture and Pavement System, U.S. Patent no. 5,707,171, (1998).
P. Xie, P. Gu, Y. Fu and J. J. Beaudoin, Conductive Cement-Based Compositions, U.S. Patent 5,447,564 (1995).
P. Xie and J. J. Beaudoin, Electrically Conductive Concrete and Its Application in Deicing, ACI SP 154-21, Advances in Concrete Technology, edited by V. M. Malhotra (1995) p. 399.
V. N. Prokushin, A. A. Shubin, V. V. Klejmenov and Eh. N. Marmer Khimicheskie Volkna (6) (1992) 50.
B. Song and R. Viskanta J. Therm. Heat Trans. 4(3) (1990) 311.
M. Higaki, M. Narita and M. Nakayama NEC Research Development (89) (1988) 81.
U.S. Patent No. 5,912,080.
U.S. Patent No. 6,083,625.
R. Chugh and D. D. L. Chung Carbon 40(13) (2002) 2285.
T. Kim and D. D. L. Chung ibid. 41(12) (2003) 2436.
J. Tsukamoto, A. Takahashi, J. Tani and T. Ishiguro ibid. 27(6) (1989) 919.
C.T. Ho and D. D. L. Chung ibid. 28(6) (1990) 825.
V. Gupta, R. B. Mathur, O. P. Bahl, A. Marchand and S. Flandrois ibid. 33(11) (1995) 1633.
D. E. Wessbercher, W. C. Forsman and J. R. Gaier Synth Met. 26(2) (1988) 185.
C. HÉrold, A. HÉrold and P. Lagrange J. Phys. Chem. Solids 57(6–;;8) (1996) 655.
S. Wang and D. D. L. Chung Comp. Interf. 6(6) (1999) 519.
D. D. L. Chung Comp. Interf. 6(6) (1999) 497.
S. Wen and D. D. L. Chung Cem. Concr. Res. 29(12) (1999) 1989.
M. Sun, Z. Li, Q. Mao and D. Shen Cem. Concr. Res. 28(4) (1998) 549.
Z. LI, Q. MAO and D. Shen Cem. Concr. Res. 28(12) (1998) 1707.
Z. LI, Q. MAO and D. Shen Cem. Concr. Res. 29(5) (1999) 769.
S. Wen and D. D. L. Chung ibid. 30(4) (2000) 661.
P.-W. Chen and D. D. L. Chung Composites: Part B 27B (1996) 269.
P.-W. Chen ACI Mater. J. 93(2) (1996) 129.
A. M. Brandt and L. Kucharska, Materials for the New Millennium, in Proc. Mater. Eng. Conf. (ASCE, New York, NY, 1996) Vol. 1, p. 271.
N. Banthia and J. Sheng Cem. Concr. Compos 18(4) (1996) 251.
B. Mobasher and C. Y. Li ACI Mater. J. 93(3) (1996) 284.
M. Pigeon, M. Azzabi and R. Pleau Cem. Concr. Res. 26(8) (1996) 1163.
N. Banthia, C. Yan and K. Sakai Cem. Concr. Compos. 20(5) (1998) 393.
T. Urano, K. Murakami, Y. Mitsui and H. Sakai Composites—Part A: Appl. Sci. Manufact. 27(3) (1996) 183.
S. Wen and D. D. L. Chung J. Mater. Res. 16(7) (2001) 1989.
R. A. Horne J. Appl. Phys. 30 (1959) 393.
V. H. Guerrero, S. Wang and S. Wen J. Mater. Sci. 37(19) (2002) 4127.
D. J. Bergman and L. G. Fel J. Appl. Phys. 85 (1999) 8205.
M. Kambe Mater. Sci. Forum 308–;;311 (1999) 653.
M. Arai, M. Kambe, T. Ogata and Y. Takahashi Nippon Kikai Gakkai Ronbunshu, a Hen 62(594) (1996) 1996.
C. Uher Phys. Rev. B 25(6) (1982) 4167.
Y. M. Hoi and D. D. L. Chung Carbon 40(7) (2002) 1134.
Y. Hishiyama and A. Ono ibid. 23(4) (1985) 445.
Y. Kaburagi and Y. Hishiyama ibid. 36(11) (1998) 1671.
A. Ono and Y. Hishiyama Philos. Mag. B—Phys. Cond. Matter. Struct. Electr. Opt. Magn. Prop. 59(2) (1989) 271.
J. P. Heremans, Extended Abstracts and Program—17th Biennial Conference on Carbon (American Carbon Society, University Park, PA, 1985) p. 231.
J. Tsukamoto, A. Takahashi, T. Tani and T. Ishiguro Carbon 27(6) (1989) 919.
X. Wang and D. D. L. Chung ibid. 35(5) (1997) 706.
S. Wang and D. D. L Chung ibid. 35(5) (1997) 621.
B. T. Kelly, “Physics of Graphite” (Applied Science Publishers, London, 1981).
X. Fu, W. Lu and D. D. L. Chung Cem. Concr. Res. 26(7) (1996) 1007.
X. Fu, E. Ma and D. D. L. Chung ibid. 27(6) (1997) 845.
X. Fu, W, Lu and D. D. L. Chung ibid. 28(2) (1998) 183.
P. Chen and D. D. L. Chung Smart Mater. Struct. 2 (1993) 22.
P. Chen J. Amer. Ceram. Soc. 78(3) (1995) 816.
D. D. L. Chung J. Electroceram. 6(1) (2001) 75.
P. Chen and D. D. L. Chung ACI Mater. J. 93(4) (1996) 341.
D. D. L. Chung Smart Mater. Struct. 4 (1995) 59.
X. Fu and D. D. L. Chung Cem. Concr. Res. 26(1) (1996) 15.
D. D. L. Chung Cem. Concr. Res. 27(9) (1997) 1313.
Z. Shi and D. D. L. Chung ibid. 29(3) (1999) 435.
S. Wen and D. D. L. Chung ibid. 30(8) (2000) 1289.
D. D. L. Chung Cem. Concr. Res. 31(2) (2001) 297.
D. D. L. Chung Cem. Concr. Res. 31(4) (2001) 665.
Q. Mao, B. Zhao, D. Shen, Z. Li, J. Wuhan and U. Tech Mater. Sci. Ed. 11(3) (1996) 41.
Q. Mao, B. Zhao, D. Shen and Z. Li Fuhe Cailiao Xuebao/Acta Materiae Compositae Sinica 13(4) (1996) 8.
B. Zhao, Z. Li, D. Wu, J. Wuhan and U. Tech Mater. Sci. Ed. 10(4) (1995) 52.
D. D. L. Chung J. Mater. Sci. 36 (2001) 1315.
S. Wen and D. D. L. Chung Cem. Concr. Res. 31(2) (2001) 291.
M. Sun, Q. Liu, Z. Li and Y. Hu ibid. 30(10) (2000) 1593.
D.-M. Bontea, D. D. L. Chung and G. C. Lee ibid. 30(4) (2000) 651.
J. Lee and G. Batson, Materials for the New Millenium, in Proc. 4th Mater. Eng. Conf. (1996) Vol. 2, p. 887.
J. Cao and D. D. L. Chung Cem. Concr. Res. 31(4) (2001) 669.
J. Cao J. Mater. Sci. 36(18) (2001) 4345.
S. Wen and D. D. L. Chung Cem. Concr. Res. 29(6) (1999) 961.
W. J. Mccarter J. Amer. Ceram. Soc. 78(2) (1995) 411.
S. Wang and D. D. L. Chung Polym. Comp. 22(1) (2001) 42.
N. Muto, H. Yanagida, T. Nakatsuji, M. Sugita, Y. Ohtsuka and Y. Arai Smart Mater. Struct. 1 (1992) 324.
X. Wang, X. Fu and D. D. L. Chung J. Mater. Res. 14(3) (1999) 790.
X. Wang and D. D. L. Chung Composites: Part B 29B(1) (1998) 63.
P. E. Irving and C. Thiogarajan Smart Mater. Struct. 7 (1998) 456.
X. Wang and D. D. L. Chung Polym. Compos. 18(6) (1997) 692.
X. Wang, S. Wang and D. D. L. Chung J. Mater. Sci. 34(11) (1999) 2703.
S. Wang and D. D. L. Chung Polym. Compos. 9(2) (2001) 135.
N. Muto, H. Yanagida, M. Miyayama, T. Nakatsuji, M. Sugita and Y. Ohtsuka J. Ceram. Soc. Jpn. 100(4) (1992) 585.
N. Muto, H. Yanagida, T. Nakatsuji, M. Sugita, Y. Ohtsuka, Y. Arai and C. Saito Adv. Compos. Mater. 4(4) (1995) 297.
R. Prabhakaran Experim. Techn. 14(1) (1990) 16.
M. Sugita, H. Yanagida and N. Muto Smart Mater. Struct. 4(1A) (1995) A52.
A. S. Kaddour, F. A. R. Al-Salehi, S. T. S. Al-Hassani and M. J. Hinton Comp. Sci. Tech. 51 (1994) 377.
O. Ceysson, M. Salvia and L. Vincent Scripta Materialia 34(8) (1996) 1273.
K. Schulte and C. Baron Comp. Sci. Tech. 36 (1989) 63.
K. Schulte and J. Physique IV Colloque C7 3 (1993) 1629.
J. C. Abry, S. Bochard, A. Chateauminois, M. Salvia and G. Giraud Comp. Sci. Tech. 59(6) (1999) 925.
A. Tedoroki, H. Kobayashi and K. Matuura JSME Int. J. Series A—Solid Mech. Streng. Mater. 38(4) (1995) 524.
S. Hayes, D. Brooks, T. Liu, S. Vickers and G. F. Fernando, in Proc. SPIE—The Int. Soc. for Optical Engng. 2718 (1996) 376.
S. Wang, Z. Mei and D. D. L. Chung Int. J. Adh. Adh. 21(ER6) (2001) 465.
S. Wang and D. D. L. Chung Polym. Polym. Comp. 9(2) (2001) 135.
S. Wang, Z. Mei and D. D. L. Chung Int. J. Adh. Adh. 21(ER6) (2001) 465.
S. Wang and D. D. L. Chung Comp. Interf. 6(6) (1999) 497.
S. Wang Composites: Part B 30(6) (1999) 591.
S. Wang Carbon 35(5) (1997) 621.
P. J. Mather and K. M. Thomas J. Mater. Sci. 32(7) (1997) 1711.
H. Tang, X. Chen and Y. Luo Eur. Polym. J. 32(8) (1996) 963.
C.-M. Chan, C.-L. Cheng and M. M. F. Yuen Polym. Eng. Sci. 37(7) (1997) 1127.
M. OmastovÁ, J. ProkeŠ, S. PodhradskÁ and I. ChodÁk Macromol. Symp. 170 (2001) 231.
N. A. Kovalenko and I. K. Syrovatskaya Int. Polym. Sci. Tech. 28(6) (2001) T/57.
Y. Chekanov, R. Ohnogi, S. Asai and M. Sumita J. Mater. Sci. 34(22) (1999) 5589.
Z. Yao, H. W. C. Postma, L. Balents and C. Dekker Nature 402 (1999) 273.
E. G. Wolff and D. A. Schneider Int. J. Heat Mass Transfer 41(22) (1998) 3469.
T. Ouellette and M. De Sorgo, Thermal Performance of Heat Transfer Interface Materials, in Proc. Power Electronics Design Cont., Power Sources Users Conf. (Cerritos, CA, 1985) p. 134.
M. R. Vogel, Thermal Performance for a Miniature Heat Sink Cooled by MicroPCM Slurry, in Proc. Int. Intersociety Electronic Packaging Conf., Adv. In Electronic Packaging (American Society of Mechanical Engineers, New York, NY, 1995) Vol. 10–;;12, p. 989.
S. W. Wilson, A. W. Norris, E. B. Scott and M. R. Costello, Thermally Conductive Adhesives for Highly Thermally Stressed Assembly, National Electronic Packaging and Production Conf., Proc. Technical Program (Reed Exhibition Companies, Norwalk, CT, 1996) Vol. 2, p. 788.
A. L. Peterson, Silicones with Improved Thermal Conductivity for Thermal Management in Electronic Packaging, in Proc. 40th Electronic Components and Tech. Conf. (IEEE, Piscataway, NJ, 1990) Vol. 1, p. 613.
X. Lu, G. Xu, P. G. Hofstra and R. C. Bajcar J. Polym. Sci., Part B 36(13) (1998) 2259.
T. Sasaski, K. Hisano, T. Sakamoto, S. Monma, Y. Fijmori, H. Iwasaki and M. Ishizuka, Development of sheet type thermal conductive compound using AlN. Japan IEMP Symp. Proc., IEEE/CPMT Int. Electronic Manufacturing Technology (IEMT) Symp. (IEEE, Piscataway, NJ, 1995) p. 236.
C.-K. Leong and D. D. L. Chung Carbon 41(13) (2003) 2459.
Y. Xu, C. K. Leong and D. D. L. Chung, unpublished results.
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Chung, D.D.L. Electrical applications of carbon materials. Journal of Materials Science 39, 2645–2661 (2004). https://doi.org/10.1023/B:JMSC.0000021439.18202.ea
Issue Date:
DOI: https://doi.org/10.1023/B:JMSC.0000021439.18202.ea