Elsevier

Scripta Materialia

Volume 98, 15 March 2015, Pages 28-31
Scripta Materialia

Failure mechanisms in metal–metal nanolaminates at elevated temperatures: Microcompression of Cu–W multilayers

https://doi.org/10.1016/j.scriptamat.2014.11.007Get rights and content

Nanolaminates of Cu and W with a bilayer thickness ratio of 1:1 and individual layer thicknesses of 5, 20 and 100 nm were studied by using elevated temperature microcompression. Failure in all the multilayers with different interlayer thicknesses occurs by rupture of the W interlayers, resulting in local strain softening and shearing at ambient temperature and lateral plastic flow of the Cu layers confined between the harder W layers at lower stresses with increasing testing temperatures.

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    As shown in Figs. 2-5, deviations from linear-elastic behavior and the yield point of the micropillars was determined by the formation of shear bands and highly localized plasticity at the top of the pillars. Shear banding has been reported in a wide variety of nanolayered materials [49,58-64], and it is generally appreciated that shear bands in layered microstructures are triggered by the breeching of interfaces. The shear bands in our micropillars with perpendicular CTBs were found to be non-crystallographic; they formed at angles in the range of 35-40° from the pillar surface and remained relatively constant across the entire shear band, suggesting that they are associated with the maximum resolved shear stress.

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