Development of a heat-generable mold insert and its application to the injection molding of microstructures
Graphical abstract
Introduction
Micro-structured components have many potential applications. Plastics are very suitable for their fabrication. Therefore, technology for manufacturing plastic micro-structures is very important. Plastic micro-structures of high quality must be fabricated more economically as micro-structured components are becoming more extensively utilized. Injection molding is anticipated strongly to favor the mass production of plastic micro-structures of stable and good quality. However, the common characteristic of designed micro-structured components is that column- or wall-shaped micro-structures with high aspect ratios densely stand erect on a base plate, and these micro-structures cannot be given a draft or a taper angle because of limitations on the functional requirements of the product and the fabrication of mold insert. Accordingly, de-molding interference or the gripping of the mold insert by cooled molded plastic is liable to occur, causing de-molding fracture during the injection molding of plastic components with surface micro-structures [1], [2], [3]. This problem is considered to be caused by the stress field that is established by the difference between the shrinkage ratios of the plastic and the mold insert material. Although the shrinkage ratio of plastic can be regulated by controlling the specific volume of plastic inside the mold cavity with pressure applied during cooling, uniformly distributing the pressure to ensure uniform shrinkage of the molded plastic is difficult [4], [5]. Additionally, the pressure on the plastic during cooling may cause not only residual stress in the molded product but also damage to the mold insert. Hence, the de-molding problem associated with the injection molding of micro-structures described above cannot be expected to be solved by applying a pressure to the plastic during cooling [6].
In recent years, variotherm mold technique [7], [8], [9] and surface modification such as PVD coating [10] have been applied to help the filling and de-molding in the injection molding of microstructures. Nevertheless, the issue due to thermal shrinkage described above does not completely be solved yet especially when the diameter (or the thickness) of the microstructure as small as 10 μm [10]. The dynamical mold temperaturing process leads to an increase in the cycle time as used in conventional process [11], [12]. The high temperature range variation can also decrease the lifetime of the mold [13], [14]. Moreover, high temperature inhomogeneities may occurs on the variothermally tempered mold wall [15].
This study proposes a novel mold insert and a new strategy for controlling temperature in a mold. The mold insert has an independent heating function that can be employed to increase rapidly the temperature of the walls of micro-cavities during cooling in an injection molding process, actively controlling the temperature distribution and the sequence of solidification of the plastic inside the mold cavity. This mold insert can greatly reduce the shrinking stress in the cooled plastic, solving the de-molding problem described above without having to use other auxiliary design such as the thermal stress barrier [16].
Section snippets
Design and fabrication of the heat-generable mold insert
Fig. 1 presents the concept of the heat-generable mold insert. This mold insert is made of a P-type single-crystal silicon wafer. Silicon processes are used to build micro-cavities of specified dimensions and shapes on the surface of one side of the mold insert. Ion implantation process is utilized to dope N-type phosphorus ions into specific areas under the surface on the same side of the silicon mold insert to make these areas electrically conducting [17]. Consequently, silicon-based
Doping characteristics and performance of silicon-based electrically conducting lines
The implantation energy and dose are the main parameters in the ion implantation process. Distribution of the concentration of implanted phosphorus ions in the direction of wafer thickness are controlled by adjusting these two parameters, which determines the characteristics of the silicon-based conducting lines. Fig. 3 shows the results of the secondary ion mass spectroscopy (SIMS) analysis of two cases of doping with different implantation energies. The maximum of the concentration of
Application of heat-generable mold insert to the injection molding of micro-structures
In this work, as described above, the developed heat-generable mold insert is adopted to control the thermal/mechanical states of the molding plastic during cooling to solve the de-molding problems that arise in the injection molding of micro-structures [21]. Some molding defects in the micro-structures with high aspect ratios that are caused by the shrinkage of the plastic, as shown in Fig. 9, can easily be detected, when a common injection molding process is used in which the novel mold
Conclusion
A micro-heater-embedding mold insert for the injection molding of plastic micro-structures with high aspect ratios was presented. The micro heater, created by implanting phosphorus ions into the surface of a silicon mold insert, was demonstrated to exhibit stable physical properties and excellent heating performance, making it very appropriate for continuous injection molding. Using these micro heaters to heat the wall of the mold insert with micro-cavities and the nearby plastic for a
Acknowledgment
The authors would like to thank the National Science Council of the Republic of China for financially supporting this research under Contract No. NSC 94-2212-E-009-010.
References (21)
- et al.
Microelectron. Eng.
(2000) - et al.
Microelectron. Eng.
(2006) - et al.
Nanotechnology
(2003) - et al.
Poly. Eng. Sci.
(1998) - et al.
Poly. Eng. Sci.
(1998) - et al.
Microsys. Technol.
(2002) - et al.
Microsys. Technol.
(2005) - et al.
J. Micromechanics Microeng.
(2008) - et al.
J. Micromechanics Microeng.
(2011) - et al.
Prod. Eng.
(2011)