Dip coating of charged colloidal suspensions onto substrates with patterned wettability: Coating regime maps

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Abstract

Aqueous dispersions of silica nanoparticles were dip coated onto Si substrates that contained patterned wettability. The patterns were prepared by photolithography and consisted of groups of hydrophilic lines (5–100 μm wide) separated by hydrophobic areas (5–100 μm wide). Coating were made from two aqueous silica dispersions: a cationic dispersion in which particles have positive surface charge, and an anionic dispersion in which particles have negative surface charge. Coating morphology, thickness, and pattern quality were characterized. For a pattern containing 25 μm wide hydrophilic stripes separated by equally wide hydrophobic spaces, coating regime maps were created to show the effect of process variables on pattern features and morphology. Within the map there is a critical concentration for both dispersions, above which uniform stripes are formed and below which a segregated non-uniform structure results. Coatings prepared at withdrawal rates of 0.1 mm/s or lower resulted in a monolayer of coatings in the case of cationic silica and no deposition in the case of anionic silica. A maximum withdrawal rate was also found; above a critical speed, excess liquid is entrained and results in nonuniformity in the bottom of the pattern. The physical origin of the regimes and differences between the two types of particles are discussed.

Graphical abstract

Coating regime map for silica coating on a chemically patterned substrate.

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Research highlights

► Dip coating of silica nanoparticle dispersions onto chemically patterned substrates. ► A ‘coating regime map’ shows effect of variables on morphology. ► Uniform particle patterns created with more concentrated suspensions (>10 wt.%). ► Silica with positive surface charge, cationic silica, forms monolayer at low rates.

Introduction

Research on using wettability differences to pattern devices has emerged recently due to interest in microelectronic devices [1], [2] and microfluidic applications [3], [4], [5]. While still a budding technique, patterning through wettability differences has been studied both experimentally [6], [7], [8], [9], [10] and theoretically [11], [12], [13], [14], [15]. However, routes that combine a substrate with patterned wettability and a conventional coating process for distributing materials onto patterns have not received much attention [16], [17], [18]. In this combination, a coating solution or dispersion is deposited onto a substrate patterned with a wettability difference, the coating liquid dewets from the hydrophobic (or hydrophilic) area, and material is deposited on the wetted hydrophilic (or hydrophobic), areas. The result is a patterned coating. Among the conventional coating processes, dip coating is a simple and inexpensive technique, and its physics are relevant to several industrial processes [19]. This work, therefore, explores dip coating of a substrate with patterned wettability.

The experimental research so far has focused on the preferential wetting of aqueous particulate dispersions onto substrates with patterned wettability [6], [7], [8], [20], [21], [22]. The intricacies of the coating process itself are not studied in these works. For example, Heule et al. [8] investigated the deposition of ceramic particulates through the use of both patterned wettability and coating processes. They prepared tin oxide and aluminum oxide patterns using dip coating or dropping the suspension onto a tilted patterned substrate. Unfortunately, information about dip coating rates was not included. Fustin et al. [21] describe the dip coating of silica particulates onto a substrate patterned with wettability. Colloidally crystalline patterns were made and parameters that influence these colloidal crystals were investigated. The typical coating rate to make a colloidally crystalline pattern was in the range of microns per minute, orders of magnitude lower than a practical coating rate. Interestingly, stripe patterns have also been demonstrated to form spontaneously from colloidal suspensions by dip coating on homogeneous surfaces [23]. Such stripe patterns form at low withdrawal rates on the order of 100 μm/min or lower, with stripes being oriented perpendicular to the direction of withdrawal.

Theoretical research in the area of patterned wettability has focused on dewetting of a model liquid coating on a patterned substrate [11], [12], [24]. While the results are useful in understanding how dewetting happens and how to create optimal conditions for dewetting, [3] these results do not account for how coating methods might affect dewetting on a patterned substrate.

Darhuber et al. [25] and Davis [26] studied dip coating onto patterned substrates. Darhuber et al. [25] developed a scaling relation that describes the wet coating thickness as a function of pattern width and withdrawal speed. For dip coating of a substrate with a vertical hydrophilic strip of width W surrounded by a planar, hydrophobic surface, the entrained liquid film thickness at the center of the stripe is given byhW(Ca)1/3where Ca denotes the capillary number, μU/σ. Here μ refers to the viscosity of the liquid, σ is the surface tension and U is the withdrawal rate. Davis [26] later showed that the proportionality constant in Eq. (1) is ∼0.356. It is worth noting that Eq. (1) was derived in the regime Ca  1. This equation has also been shown to agree with experimental data for silicon substrates patterned with octadecyl trichlorosilane and then dip coated with a model liquid [25]. However, rate limits, drying, and other practical concerns in implementing the method were not investigated.

This paper presents a systematic study of the effects of coating parameters on coating quality, morphology, and limits to create patterned coatings. A range of coating conditions are explored for aqueous silica dispersions deposited onto patterned silicon substrates. Photolithography is used to create patterns and chemical functionality is introduced by self assembled monolayers [27] (SAMs). Coatings of particulate dispersions are created using dip coating. Coating regime maps are used to show the effect of process conditions on the coating morphology and in particular to define the process space for uniform patterned coatings. The effects of particle charge, dispersion concentration, dip coating withdrawal rate, and pattern feature sizes are considered. Combining knowledge of the effects of processing variables along with interfacial science and liquid transport, we also identify possible mechanisms that govern coating morphologies, rate limits and quality.

Section snippets

Experimental methods

The experimental procedure involved three stages: patterning the substrate, dip coating and subsequent characterization.

Dispersion properties

Fig. 2 shows viscosity of the dispersions as a function of shear rate. The stock dispersions (20 wt.% silica) shear thin slightly; this behavior is more noticeable with cationic silica. As the dispersion concentration is decreased, the behavior becomes Newtonian and the viscosity approaches that of pure water (1 mPa s). The viscosities of the cationic and anionic dispersions are similar at low-concentration. At 20 wt.%, however, the cationic silica dispersion has a significantly higher viscosity

Discussion

In this section, the possible mechanisms behind formation of different regimes in the coating regime maps in Fig. 7 are explained.

Summary

Aqueous dispersions of colloidal silica, having positive and negative surface charges, were dip coated onto Si substrates patterned by wettability. The patterns on the substrate consisted of groups of alternating hydrophilic and hydrophobic lines of widths on the length scale of 5–100 μm. Coating regime maps were created for a group of 25 μm wide hydrophilic lines separated by equal hydrophobic spacing. The coating conditions required to produce uniform and segregated patterned coatings were

Acknowledgments

This work was supported through the Industrial Partnership for Research in Interfacial and Materials Engineering at the University of Minnesota. The research also made use of the Nanofabrication Center and Characterization Facility at the University of Minnesota.

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