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A Quantitative Study on the Interaction Between Silicon Content and Heat Treatment on Thermal Conductivity of Al-Si Binary Alloys

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Abstract

In this study, the room temperature thermal conductivities and microstructures of Al-Si binary alloys in as-cast, low-temperature annealing state and solid solution state are investigated. The experimental results show that annealing treatment increases the thermal conductivities of these alloys because of the decreasing Si concentration in α-Al matrix, which is determined by EPMA. The effect of solution treatment on the thermal conductivity of Al-xSi (0 ≤ x ≤ 12) alloys can be divided into two stages. When the Si content is less than 3 wt%, the thermal conductivities of solution treated specimens are lower than that of as-cast, which is mainly attributed to the increase in Si concentration. However, solution treatment improves the thermal conductivities of Al-xSi (x > 3) alloys owing to the spheroidization of Si phase. Quantitative study is conducted on the effect of Si element on thermal conductivity of as-cast Al-xSi alloys. The thermal conductivities of Al-xSi alloys are fitted using modified Series and Maxwell models based on the Si concentration in α-Al matrix, distribution and volume fractions of Si phases. The modified structural models provide a better fit to the measured thermal conductivity data.

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Acknowledgements

This work was supported by GDAS' Project of Science and Technology Development (2019GDASYL- 4700203002), Key Research and Development Program of Guangdong Province (2020B010186002), Science and Technology Project of Zhaoqing City (2021C003), Science and Technology Project of Zhaoqing City (2018K006), and Development of Key Technologies for Material and Microstructure Control of High Thermal Conductivity Casting Aluminum Alloy (2014A030313221).

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Authors and Affiliations

  1. Guangdong Provincial Key Laboratory of Metal Toughening Technology and Application, Institute of New Materials, Guangdong Academy of Sciences, Chang Xing Road 363, Tianhe District, Guangzhou, 510650, People’s Republic of China

    Gan Luo & Zhenghua Huang

  2. Hong Kong Joint Research and Development Center on Advanced Manufacturing Technology for Light Alloys, Institute of New Materials, Guangdong Academy of Sciences, Guangzhou, 510650, People’s Republic of China

    Gan Luo & Zhenghua Huang

  3. Department of Metallic Materials, School of Materials Science and Engineering, South China University of Technology, Wu Shan Road 381, Tianhe District, Guangzhou, 510640, People’s Republic of China

    Gan Luo, Xiong Zhou, Chengbo Li & Jun Du

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  1. Gan Luo
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Correspondence to Zhenghua Huang or Jun Du.

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Luo, G., Zhou, X., Li, C. et al. A Quantitative Study on the Interaction Between Silicon Content and Heat Treatment on Thermal Conductivity of Al-Si Binary Alloys. Inter Metalcast 16, 1585–1594 (2022). https://doi.org/10.1007/s40962-021-00706-4

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  • DOI: https://doi.org/10.1007/s40962-021-00706-4

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