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Experimental and numerical investigation of residual stress and post-weld-shift of coaxial laser diodes during the optoelectronic packaging process

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Abstract

As an efficient and high-quality welding process, laser welding is widely used in the optoelectronic packaging field. In the study of the packaging quality provided by optoelectronic devices, the understanding of their residual stress and post-weld-shift (PWS) characteristics is of great significance. Based on the thermal elastic–plastic theory, a three-dimensional finite element model is developed, to simulate and predict the residual stress and PWS of the coaxial laser diodes, after packaging. At the same time, a method for quantifying PWS is proposed, to determine the PWS of the device by using the change of optical power before and after packaging. It solves the problem of PWS inability to measure in real time, while it realizes the comparison between simulation and experimental results. The derived conclusions show that, the established finite element model exhibits high accuracy, the PWS post-packaging error can be controlled within 0.1 μm, whereas the model can effectively simulate and predict the packaging situation of the device. Finally, the influence of welding platform error on the device packaging quality is analyzed through the model, providing a guide for the optimal design of the welding packaging platform.

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Funding

This work was supported in part by the National Natural Science Foundation of China [grant number 51975590].

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Authors and Affiliations

  1. State Key Laboratory of High-Performance Complex Manufacturing, Central South University, No.932 Lushan South Road, Changsha, 410000, China

    Ziyang Wang, Haibo Zhou, Wangwang Zhou, Zhiqiang Li, Xia Ju, Yichang Peng & Ji’an Duan

Authors
  1. Ziyang Wang
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  2. Haibo Zhou
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  3. Wangwang Zhou
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  4. Zhiqiang Li
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  5. Xia Ju
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  6. Yichang Peng
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  7. Ji’an Duan
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Contributions

All authors contributed to the study conception and design. Material preparation, data collection, and analysis were performed by Ziyang Wang, Haibo Zhou, and Wangwang Zhou. The first draft of the manuscript was written by Ziyang Wang and all authors commented on previous versions of the manuscript. All authors read and approved the final manuscript.

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Correspondence to Haibo Zhou.

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Wang, Z., Zhou, H., Zhou, W. et al. Experimental and numerical investigation of residual stress and post-weld-shift of coaxial laser diodes during the optoelectronic packaging process. Weld World 67, 63–76 (2023). https://doi.org/10.1007/s40194-022-01404-3

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  • DOI: https://doi.org/10.1007/s40194-022-01404-3

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