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Wetting Behavior and Evolution of Microstructure of Sn–3.5Ag Solder Alloy on Electroplated 304 Stainless Steel Substrates

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Abstract

In the present study, wetting characteristics and evolution of microstructure of Sn–3.5Ag solder on Ag/Ni and Ni electroplated 304 stainless steel (304SS) substrates have been investigated. Solder alloy spread on Ag/Ni plated 304SS substrates exhibited better wetting as compared to Ni/304SS substrate. The formations of irregular shaped and coarser IMCs were found at the interface of solder/Ni/304SS substrate region whereas, solder/Ag/Ni/substrate interface showed continuous scallop and needle shaped IMCs. The precipitation of Ag3Sn, Ni–Sn, FeSn2 and lesser percentage of Fe–Cr–Sn IMCs were found at the interface of solder/Ag/Ni/substrate region whereas, solder/Ni/304 SS substrate exhibited predominantly FeSn2 and Fe–Cr–Sn IMCs. Presence of higher amount of Fe–Cr–Sn IMCs at the solder/Ni/304SS substrate interface inhibited the further wetting of solder alloy.

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Acknowledgments

One of the authors (KNP) thank the Defence Research Development Organisation (DRDO), Government of India, New Delhi, for providing financial assistance for procurement of dynamic contact angle analyzer. The fellowship given by Deakin University, Australia to the first author (VUN) is also gratefully acknowledged.

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Authors and Affiliations

  1. Department of Metallurgical & Materials Engineering, National Institute of Technology Karnataka, Surathkal, Mangalore, 575 025, India

    Vignesh U. Nayak, K. N. Prabhu &  Satyanarayan

  2. Institute for Frontier Materials, Deakin University, Melbourne, Australia

    Nicole Stanford

Authors
  1. Vignesh U. Nayak
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  2. K. N. Prabhu
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  3. Nicole Stanford
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  4. Satyanarayan
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Correspondence to K. N. Prabhu.

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Nayak, V.U., Prabhu, K.N., Stanford, N. et al. Wetting Behavior and Evolution of Microstructure of Sn–3.5Ag Solder Alloy on Electroplated 304 Stainless Steel Substrates. Trans Indian Inst Met 65, 713–717 (2012). https://doi.org/10.1007/s12666-012-0193-y

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  • DOI: https://doi.org/10.1007/s12666-012-0193-y

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