Abstract
Studies in the past focused on the implementation of semi-passive damping techniques that could significantly reduce structural vibration. Recently, the performances of these damping techniques have been enhanced by artificially increasing the voltage amplitude delivered by the piezoelectric patches with an external voltage source. To maintain the stability of this damping method, an adaptive voltage source must be used. To satisfy this requirement, this study proposes an enhanced semi-passive damping technique based on pulse-width modulation. The proposed method allows the waveform of the piezoelectric voltage to adapt to the vibration velocity. Thus, this method can maintain its stability with a constant voltage source and simultaneously exhibit superior performance. This study consists of a theoretical part and an experimental proof-of-concept demonstration of the proposed damping technique.
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Recommended by Editor Yeon June Kang
Yuan-Ping Liu received his B.S. degree in Mechanical Engineering from National Taiwan University, Taiwan in 2004. He received his joint Ph. D. in Engineering Science and Ocean Engineering from National Taiwan University, Taiwan and Electrical Engineering from Ecole Normale Supérieure de Cachan, France in 2009. He is the CEO of Miézo Inc., Taiwan, which produces flat speakers and piezoelectric transformers. His research interests include vibration control, energy harvesting, ultrasonic transducers, and power electronics.
Dejan Vasic obtained his Agrégation, Master’s, and Doctoral degrees in Electrical Engineering from Ecole Normale Superieure de Cachan (France) in 1998, 2000, and 2003, respectively. He is currently an Assistant Professor of Electrical Engineering at the University of Cergy-Pontoise (France). His main research interests include piezoelectric materials for power electronics, DC-DC converters, energy harvesting, and structural damping.
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Liu, YP., Vasic, D. Semi-passive piezoelectric structural damping based on a pulse-width modulation switching circuit. J Mech Sci Technol 27, 3625–3633 (2013). https://doi.org/10.1007/s12206-013-0906-0
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DOI: https://doi.org/10.1007/s12206-013-0906-0