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Microstructural Characterization of Diffusion Bonds Assisted by Ni/Ti Nanolayers

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Abstract

The microstructure of similar and dissimilar diffusion bonds of metallic materials using reactive Ni/Ti interlayers was studied in this investigation. The base material surfaces were modified by sputter deposition of alternated Ni and Ti nanolayers. These nanolayers increase the diffusivity at the interface, enhancing the bonding process. Bonding experiments were performed at 800 °C under a pressure of 10 MPa with a bonding time of 60 min. The reaction zone was characterized by high-resolution scanning and transmission electron microscopies. Microstructural characterization reveals that similar (NiTi to NiTi and TiAl to TiAl) and dissimilar (NiTi to Ti6Al4V and TiAl to stainless steel) joints can be obtained successfully with Ni/Ti reactive nanolayers. The interfaces are thin (<10 µm) and their microstructure (thickness and number of zones, size and shape of the grains) depends on the elements diffusing from the base materials. For all joints, the interface is mainly composed of equiaxed grains of NiTi and NiTi2.

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Acknowledgments

This research is sponsored by FEDER funds through the program COMPETE—Programa Operacional Factores de Competitividade—and by national funds through FCT—Fundação para a Ciência e a Tecnologia—under the project UID/EMS/00285/2013. The authors are grateful to CEMUP—Centro de Materiais da Universidade do Porto for expert assistance with SEM.

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Correspondence to Sónia Simões.

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This article is an invited submission to JMEP selected from presentations at the Symposium “Joining Technologies,” belonging to the Topic “Joining and Interfaces” at the European Congress and Exhibition on Advanced Materials and Processes (EUROMAT 2015), held on September 20-24, 2015, in Warsaw, Poland, and has been expanded from the original presentation.

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Simões, S., Viana, F., Sofia Ramos, A. et al. Microstructural Characterization of Diffusion Bonds Assisted by Ni/Ti Nanolayers. J. of Materi Eng and Perform 25, 3245–3251 (2016). https://doi.org/10.1007/s11665-016-2135-z

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  • DOI: https://doi.org/10.1007/s11665-016-2135-z

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