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Microstructure and Precipitate's Characterization of the Cu-Ni-Si-P Alloy

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Abstract

Microstructure of the Cu-Ni-Si-P alloy was investigated by transmission electron microscopy (TEM). The alloy had 551 MPa tensile strength, 226 HV hardness, and 36% IACS electrical conductivity after 80% cold rolling and aging at 450 °C for 2 h. Under the same aging conditions, but without the cold rolling, the strength, hardness, and electrical conductivity were 379 MPa, 216 HV, and 32% IACS, respectively. The precipitates identified by TEM characterization were δ-Ni2Si. Some semi-coherent spherical precipitates with a typical coffee bean contrast were found after aging for 48 h at 450 °C. The average diameter of the observed semi-coherent precipitates is about 5 nm. The morphology of the fracture surface was observed by scanning electron microscopy. All samples showed typical ductile fracture. The addition of P refined the grain size and increased the nucleation rate of the precipitates. The precipitated phase coarsening was inhibited by the small additions of P. After aging, the Cu-Ni-Si-P alloy can gain excellent mechanical properties with 804 MPa strength and 49% IACS conductivity. This study aimed to optimize processing conditions of the Cu-Ni-Si-P alloys.

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Acknowledgment

This work was supported by the National Natural Science Foundation of China (51101052) and the National Science Foundation (IRES 1358088).

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Authors and Affiliations

  1. School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang, 471003, China

    Yi Zhang, Baohong Tian, Huili Sun, Zhe Chai & Yong Liu

  2. Department of Mechanical Engineering, University of South Florida, Tampa, 33620, USA

    Alex A. Volinsky

  3. School of Materials Science and Engineering, University of Shanghai for Science and Technology, Shanghai, 200093, China

    Zhe Chai, Ping Liu & Xiaohong Chen

  4. Collaborative Innovation Center of Nonferrous Metals, Luoyang, 471003, Henan, China

    Yi Zhang, Baohong Tian, Huili Sun & Yong Liu

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  1. Yi Zhang
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  2. Baohong Tian
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  3. Alex A. Volinsky
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  4. Huili Sun
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  5. Zhe Chai
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Correspondence to Yi Zhang or Alex A. Volinsky.

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Zhang, Y., Tian, B., Volinsky, A.A. et al. Microstructure and Precipitate's Characterization of the Cu-Ni-Si-P Alloy. J. of Materi Eng and Perform 25, 1336–1341 (2016). https://doi.org/10.1007/s11665-016-1987-6

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  • DOI: https://doi.org/10.1007/s11665-016-1987-6

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