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Cu-Sn Intermetallic Compound Joints for High-Temperature Power Electronics Applications

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Abstract

Cu-Sn solid–liquid interdiffusion (SLID) bonded joints were fabricated using a Sn-Cu solder paste and Cu for high-temperature power electronics applications. The interfacial reaction behaviors and the mechanical properties of Cu6Sn5 and Cu3Sn SLID-bonded joints were compared. The intermetallic compounds formed at the interfaces in the Cu-Sn SLID-bonded joints significantly affected the die shear strength of the joint. In terms of thermal and mechanical properties, the Cu3Sn SLID-bonded joint was superior to the conventional solder and the Cu6Sn5 SLID-bonded joints.

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Authors and Affiliations

  1. Welding and Joining R&D Group, Korea Institute of Industrial Technology (KITECH), 156 Gaetbeol-ro, Yeonsu-gu, Incheon, 21999, Korea

    Byung-Suk Lee & Jeong-Won Yoon

  2. Critical Materials and Semiconductor Packaging Engineering, University of Science and Technology (UST), 217 Gajeong-ro, Yuseong-gu, Daejeon, 34113, Korea

    Jeong-Won Yoon

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  1. Byung-Suk Lee
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  2. Jeong-Won Yoon
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Correspondence to Jeong-Won Yoon.

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Lee, BS., Yoon, JW. Cu-Sn Intermetallic Compound Joints for High-Temperature Power Electronics Applications. J. Electron. Mater. 47, 430–435 (2018). https://doi.org/10.1007/s11664-017-5792-2

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  • DOI: https://doi.org/10.1007/s11664-017-5792-2

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