Abstract
A method is presented to control the size of primary Cu6Sn5 in ball grid array (BGA) joints while keeping all other microstructural features near-constant, enabling a direct study of the size of primary Cu6Sn5 on impact properties. For Sn-2Cu/Cu BGA joints, it is shown that larger primary Cu6Sn5 particles have a clear negative effect on the shear impact properties. Macroscopic fracture occurred by a combination of the brittle fracture of embedded primary Cu6Sn5 rods and ductile fracture of the matrix βSn. Cleavage of the Cu6Sn5 rods occurred mostly along (0001) or perpendicular to (0001) with some crack deflection between the two. The deterioration of shear impact properties with increasing Cu6Sn5 size is attributed to (1) the larger microcracks introduced by the brittle fracture of larger embedded Cu6Sn5 crystals, and (2) the less numerous and more widely spaced rods when the Cu6Sn5 crystals are larger, which makes them poor strengtheners.
Similar content being viewed by others
References
D. Frear, D. Grivas, and J. Morris, J. Electron. Mater. 16, 181 (1987).
Y. Tian, R. Zhang, C. Hang, L. Niu, and C. Wang, Mater. Charact. 88, 58 (2014).
J.W. Xian, S.A. Belyakov, and C.M. Gourlay, J. Electron. Mater. 45, 69 (2016).
C.M. Gourlay, S.A. Belyakov, Z.L. Ma, and J.W. Xian, JOM 67, 2383 (2015).
Z.L. Ma, S.A. Belyakov, and C.M. Gourlay, J. Alloy. Compd. 682, 326 (2016).
M.A.A. Mohd Salleh, S.D. McDonald, C.M. Gourlay, S.A. Belyakov, H. Yasuda, and K. Nogita, J. Electron. Mater. 45, 154 (2016).
M. Yang, Y. Cao, S. Joo, H. Chen, X. Ma, and M. Li, J. Alloy. Compd. 582, 688 (2014).
Z. Zhang, H. Cao, H. Yang, M. Li, and Y. Yu, J. Electron. Mater. 45, 5985 (2016).
M. Li, Z. Zhang, and J. Kim, Appl. Phys. Lett. 98, 201901 (2011).
R. Gagliano and M.E. Fine, JOM 53, 33 (2001).
H.L.J. Pang, K.H. Tan, X.Q. Shi, and Z.P. Wang, Mater. Sci. Eng. A 307, 42 (2001).
Q. Zhang, J. Tan, and Z. Zhang, J. Appl. Phys. 110, 014502 (2011).
J. Wang and H. Nishikawa, Microelectron. Reliab. 54, 1583 (2014).
L. Ching-Tsung, H. Chi-Shiung, C. Tao-Chih, and L. Ming-Kann, in proccedings of 2007 International Microsystems, Packaging, Assembly and Circuits Technology, 2007. pp. 58–61.
S.M. Hayes, N. Chawla, and D.R. Frear, Microelectron. Reliab. 49, 269 (2009).
H.-T. Lee, M.-H. Chen, H.-M. Jao, and T.-L. Liao, Mater. Sci. Eng. A 358, 134 (2003).
Y.C. Chan, A.C.K. So, and J.K.L. Lai, Mater. Sci. Eng. B 55, 5 (1998).
L. Quan, D. Frear, D. Grivas, and J.W. Morris, J. Electron. Mater. 16, 203 (1987).
Y.-H. Lee and H.-T. Lee, Mater. Sci. Eng. A 444, 75 (2007).
A. Hirose, H. Yanagawa, E. Ide, and K.F. Kobayashi, Sci. Technol. Adv. Mat. 5, 267 (2004).
S. Ahat, M. Sheng, and L. Luo, J. Electron. Mater. 30, 1317 (2001).
X. Li, F. Li, F. Guo, and Y. Shi, J. Electron. Mater. 40, 51 (2011).
J.-W. Yoon, S.-W. Kim, and S.-B. Jung, J. Alloy. Compd. 391, 82 (2005).
Y. Tian, W. Liu, R. An, W. Zhang, L. Niu, and C. Wang, J. Mater. Sci. Mater. Electron. 23, 136 (2012).
K. Kim, S. Huh, and K. Suganuma, J. Alloy. Compd. 352, 226 (2003).
L. Jiang and N. Chawla, Scr. Mater. 63, 480 (2010).
J. Yu, J. Wu, L. Yu, and C. Kao, in proceedings of the 66th Electronic Components and Technology Conference (ECTC), 2016, IEEE. pp. 1135–1140
J. Yu, J. Wu, L. Yu, and C. Kao, in proceedings of the Electronic Packaging and iMAPS All Asia Conference, 2015. pp. 838–841.
D. Mu, H. Huang, S. McDonald, J. Read, and K. Nogita, Mater. Sci. Eng. 566, 126 (2013).
D. Mu, S. McDonald, J. Read, H. Huang, and K. Nogita, Curr. Opin. Solid State Mater. Sci. 20, 55 (2016).
B. Philippi, K. Matoy, J. Zechner, C. Kirchlechner, and G. Dehm, Scr. Mater. 123, 38 (2016).
M. Wang, J. Wang, H. Feng, and W. Ke, Mater. Sci. Eng. A 558, 649 (2012).
K. Kim, S. Huh, and K. Suganuma, Mater. Sci. Eng. A 333, 106 (2002).
F. Ochoa, J. Williams, and N. Chawla, JOM 55, 56 (2003).
D.W. Henderson, T. Gosselin, A. Sarkhel, S.K. Kang, W.-K. Choi, D.-Y. Shih, C. Goldsmith, and K.J. Puttlitz, J. Mater. Res. 17, 2775 (2002).
I.E. Anderson, J.W. Walleser, J.L. Harringa, F. Laabs, and A. Kracher, J. Electron. Mater. 38, 2770 (2009).
J. Gong, C. Liu, P.P. Conway, and V.V. Silberschmidt, Mater. Sci. Eng. A 527, 2588 (2010).
Z.L. Ma and C.M. Gourlay, J. Alloy. Compd. 706, 596 (2017).
S.K. Kang, D.-Y. Shih, N. Donald, W. Henderson, T. Gosselin, A. Sarkhel, N.C. Goldsmith, K.J. Puttlitz, and W.K. Choi, JOM 55, 61 (2003).
J. Xian, S. Belyakov, M. Ollivier, K. Nogita, H. Yasuda, and C. Gourlay, Acta Mater. 126, 540 (2017).
J. Xian, S. Belyakov, T. Britton, and C. Gourlay, J. Alloy. Compd. 619, 345 (2015).
Thermo-Calc, TCSLD Database version 3.0.(2015).
JESD22-B117B ‘Solder Ball Shear’
B. Peplinski, G. Schulz, D. Schultze, and E. Schierhorn, Mater. Sci. Forum 228, 577 (1996).
K. Nogita, C. Gourlay, and T. Nishimura, JOM 61, 45 (2009).
A. Telang and T. Bieler, JOM 57, 44 (2005).
T.R. Bieler and T.-K. Lee, Lead free solder review, in Encyclopedia of Materials: Science and Technology ed. By K. H. Jürgen Buschow, Robert W. Cahn, Merton C. Flemings, Bernard Ilschner (Amsterdam: Elsevier, 2010), pp. 1–12.
L. Lehman, Y. Xing, T. Bieler, and E. Cotts, Acta Mater. 58, 3546 (2010).
B. Arfaei, N. Kim, and E. Cotts, J. Electron. Mater. 41, 362 (2012).
J. Xian, Z. Ma, S. Belyakov, M. Ollivier, and C. Gourlay, Acta Mater. 123, 404 (2017).
S. Belyakov, J. Xian, K. Sweatman, T. Nishimura, T. Akaiwa, and C. Gourlay, J. Alloy. Compd. 701, 321 (2017).
H. Tsukamoto, T. Nishimura, S. Suenaga, and K. Nogita, Mater. Sci. Eng. B 171, 162 (2010).
H. Tsukamoto, T. Nishimura, S. Suenaga, S.D. McDonald, K.W. Sweatman, and K. Nogita, Microelectron. Reliab. 51, 657 (2011).
Z.H. Zhang, M.Y. Li, Z.Q. Liu, and S.H. Yang, Acta Mater. 104, 1 (2016).
D. Mu, H. Huang, S.D. McDonald, J. Read, and K. Nogita, Mater. Sci. Eng. 566, 126 (2013).
Acknowledgements
This research was funded, in part, by Nihon Superior Co., Ltd. and UK EPSRC Grant No. EP/M002241/1. We thank Prof. T.C. Lindley for valuable discussions.
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Li, Z.Q., Belyakov, S.A., Xian, J.W. et al. The Influence of Primary Cu6Sn5 Size on the Shear Impact Properties of Sn-Cu/Cu BGA Joints. J. Electron. Mater. 47, 84–95 (2018). https://doi.org/10.1007/s11664-017-5763-7
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s11664-017-5763-7