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Evolution of the Intermetallic Compounds in Ni/Sn-2.5Ag/Ni Microbumps for Three-Dimensional Integrated Circuits

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Abstract

Ni/Sn-2.5Ag/Ni samples were used to simulate the microbumps in three-dimensional (3D) packaging. The annealed test was adopted to observe the microstructure of intermetallic compound formation at 100°C, 125°C, and 150°C up to 1000 h. In the Ni/Sn-2.5Ag/Ni, predominant phases of layer-type Ni3Sn4 and Ag3Sn particles could be seen under the thermal treatment. The formation of Ni3Sn4 followed a parabolic rate law at each aging temperature. Due to the limited solder volume, the remaining solder of the microbump was completely exhausted after long-time annealing at 150°C. The activation energy for Ni3Sn4 formation in the Ni/Sn-2.5Ag/Ni microbump was 171.8 kJ/mol. Furthermore, the consumption of the Ni under bump metallization (UBM) was estimated based on the mass balance of Ni atoms during the interfacial reaction.

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Authors and Affiliations

  1. Department of Chemical and Materials Engineering, National Central University, Jhongli City, 320, Taiwan

    H. H. Hsu, Y. T. Huang & Albert T. Wu

  2. Industrial Technology Research Institute, Chutung, Hsinchu, 310, Taiwan

    S. Y. Huang & T. C. Chang

Authors
  1. H. H. Hsu
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  2. Y. T. Huang
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  3. S. Y. Huang
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  4. T. C. Chang
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  5. Albert T. Wu
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Correspondence to Albert T. Wu.

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Hsu, H.H., Huang, Y.T., Huang, S.Y. et al. Evolution of the Intermetallic Compounds in Ni/Sn-2.5Ag/Ni Microbumps for Three-Dimensional Integrated Circuits. J. Electron. Mater. 44, 3888–3895 (2015). https://doi.org/10.1007/s11664-015-3925-z

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  • DOI: https://doi.org/10.1007/s11664-015-3925-z

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