Abstract
The flux-free flip-chip bonding process using plasma treatment was investigated. The effect of plasma-process parameters on Sn oxide-etching characteristics was evaluated by Auger depth-profile analysis. The die-shear test was performed to evaluate the adhesion strength of an Sn-37mass%Pb and Sn-3.5mass%Ag solder-bump flip chip that was bonded after plasma treatment. The Ar + H2 plasma treatment reduced the thickness of the oxide layer on the Sn surface. The addition of H2 to the Ar plasma improved the oxide-etching characteristics. A low chamber pressure was more effective in oxide etching. The die-shear strength of the plasma-treated Sn-Pb and Sn-Ag solder flip chip was higher than that of the nontreated chip but lower than that of the fluxed chip. The difference in the die-shear strength between the plasma-treated specimen and the nontreated specimen increased with increasing bonding temperature. The plasma-treated flip chip fractured at the solder/top-surface metallurgy (TSM) interface at low bonding temperature, but at the solder/under-bump metallurgy (UBM) interface at high bonding temperature.
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K.F. Harsh, R.S. Irwin, and Y.C. Lee, 2000 IEEE-ECTC Conf. Proc. (Piscataway, NJ: IEEE, 2000), pp. 1690–1695.
C. Beddingfield and L.M. Higgins, IEEE Trans. CPMT Part C 21, 189 (1998).
M. Bixenaman and E. Miller, Proc. 5th Int. Joint Symp. on Microelectronics and Packaging (Seoul, Korea: IMAPSKOREA and IEEE-CPMT, 2000), p. 43.
J.H. Lau, ed., Flip Chip Technologies (New York: McGraw-Hill, 1995), pp. 83–84.
K.J. Wolter, T. Zerna, R. Deltschew, and H. Neumann, 2001 IEEE-ETCT Conf. Proc. (Piscataway, NJ: IEEE, 2001), p. 1295.
N. Koopman, S. Bobbio, S. Nangalia, J. Bousaba, and B. Piekarski, 1993 IEEE-ECTC Conf. Proc. (Piscataway, NJ: IEEE, 1993), p. 595.
H. Matsuki, H. Matsui, and E. Watanabe, Proc. 2001 Int. Symp. on Advances in Packaging Materials (2001), p. 135.
F. Masahiko, M. Tsugunori, D. Kazuhide, and N. Hiroshi, 1999 IEEE-ECTC Conf. Proc. (Piscataway, NJ: IEEE, 1999), p. 408.
C.B. Park, S.M. Hong, J.P. Jung, C.S. Kang, and Y.E. Shin, Mater. Trans. 42, 820 (2001).
G. Takyi (Ph.D. thesis, University of Salford, 1998).
D.M. Tench, The Mechanics of Solder Alloy Wetting and Spreading, ed. F.G. Yost, F.M. Hosking, and D.R. Frear (New York: Van Nostrand Reinhold, 1993), pp. 163–170.
D.M. Manos and D.L. Flamm, Plasma Etching An Introduction (Boston: Academic Press Inc., 1989), p. 36.
S.M. Hong, C.H. Kang, and J.P. Jung, 2001 Proc. Int. Symp. on Electronic Materials and Packaging (Piscataway, NJ: IEEE, 2001), p. 139.
R.J. Wassink, Soldering in Electronics (Ary, Scotland: Electrochemical Soc., 1989), p. 226.
P.E. Davis, M.E. Warwick, P.J. Kay, and S.J. Muckett, Plat. Surf. Finish. 69, 72 (1982).
T. Nishikawa, M. Ijuin, and R. Satoh, 1994 IEEE-ECTC Conf. Proc. (Piscataway, NJ: IEEE, 1994), p. 286.
S.M. Hong, J.Y. Park, J.P. Jung, and C.S. Kang, Mater. Trans. 42, 520 (2001).
A.-A.H. Mohamed, R. Block, and K.H. Schoenbach, Proc. 2001 Pulsed Power Plasma Sci. (Piscataway, NJ: IEEE, 2001), p. 384.
E.S. Paller, J.E. Scharer, R. Cao, and K.E. Kelly, Proc. 2001 Pulsed Power Plasma Science (Piscataway, NJ: IEEE, 2001), p. 393.
M. Okumoto, H.H. Kim, K. Takashima, S. Katsura, and A. Mizuno, IEEE Trans. Indust. Appl. 27, 1618 (2001).
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Hong, SM., Kang, CS. & Jung, JP. Flux-free direct chip attachment of solder-bump flip chip by Ar + H2 plasma treatment. J. Electron. Mater. 31, 1104–1111 (2002). https://doi.org/10.1007/s11664-002-0049-z
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DOI: https://doi.org/10.1007/s11664-002-0049-z