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A new method for liquid-phase bonding of copper plates to aluminum nitride (AlN) substrates used in high-power modules

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Abstract

A new method for liquid-phase bonding of copper plates to an aluminum nitride (AlN) substrate was developed in this work. A newly developed proprietary interlayer composed of titanium and silver powders was deposited on the AlN substrate using a screen-printing machine. The eutectic reaction between printed silver and copper at 850 °C led to formation of a liquid phase at the joint interface. A total of 42 samples were prepared using seven and six different amounts of silver and titanium, respectively. The microstructures of all samples were analyzed by scanning electron microscopy and energy-dispersive X-ray spectroscopy, and an ultrasonic flaw detector was used to assess joint integrity. The optimum composition of the Ti–Ag brazing alloy for producing defect-free joints was determined. The formation of a continuous titanium nitride layer was found to be essential for achieving sound joints between the copper plates and AlN substrate.

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Authors and Affiliations

  1. Central Research Institute, Mitsubishi Materials Corporation, Saitama, 330-8508, Japan

    Nobuyuki Terasaki, Touyou Ohashi, Yoshiyuki Nagatomo & Yoshirou Kuromitsu

  2. School of Engineering and Innovation, The Open University, Milton Keynes, MK7 6AA, UK

    Amir A. Shirzadi

  3. Department of Materials Science and Metallurgy, University of Cambridge, Cambridge, CB3 0FS, UK

    Amir A. Shirzadi

Authors
  1. Nobuyuki Terasaki
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  2. Touyou Ohashi
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  3. Yoshiyuki Nagatomo
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  4. Yoshirou Kuromitsu
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  5. Amir A. Shirzadi
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Correspondence to Nobuyuki Terasaki.

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Terasaki, N., Ohashi, T., Nagatomo, Y. et al. A new method for liquid-phase bonding of copper plates to aluminum nitride (AlN) substrates used in high-power modules. J Mater Sci: Mater Electron 30, 6552–6555 (2019). https://doi.org/10.1007/s10854-019-00961-6

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  • DOI: https://doi.org/10.1007/s10854-019-00961-6

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