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Recent Progress in Fabrication and Structural Design of Thermal Conductive Polymer Composites

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Abstract

In recent years, the demand direction for electronic equipment has expanded into embedded and miniaturized devices. The heat radiation problem has become one of the most significant factors for hindering the development of electronic devices. Since heat radiation material is one of the important components in electronic devices, the demand for enhancing thermal conductivity is also increasingly urgent. Research on thermal conductive polymer composites has become a major direction for developing functional composites. This work reviewed the recent progress in the fabrication of thermal conductive polymer composites. Five different structures are presented, including the using of single fillers, hybrid fillers, double threshold percolation structure, segregated structure and other complex multiphase structures. Specifically, the preparation of high-performance thermal conductive polymer composites was introduced through the combination of various thermal conductive fillers. Finally, the development direction of high thermal conductive polymer composites was briefly explored.

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Acknowledgments

This work was financially supported by Graduate Innovation Fund of Wuhan Institute of Technology, Natural Science Foundation of Hubei Province (No. 2022CFB630) and Open Fund of Key Laboratory of Green Preparation and Application for Functional Materials, Ministry of Education (Hubei University) (No. 202105).

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  1. These authors contributed equally to this work.

Authors and Affiliations

  1. Hubei Key Laboratory of Plasma Chemistry and Advanced Materials, School of Material Science and Engineering, Wuhan Institute of Technology, Wuhan, 430205, China

    Yuan-Kai Du, Zheng-Xue Shi, Shan Dong, Hui Jin, Xue Ke, Pei Zhao & Feng You

  2. Key Laboratory of Green Preparation and Application of Functional Materials, Ministry of Education, Hubei University, Wuhan, 430062, China

    Bing-Bing Jiang & Feng You

  3. Institute of Molecular Aggregation Science, Tianjin University, Tianjin, 300072, China

    Yuan-Kai Du

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  1. Yuan-Kai Du
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  2. Zheng-Xue Shi
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Correspondence to Feng You.

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Biography

Feng You received his Ph.D. degree from University of Science and Technology Beijing in 2014. He was appointed as an Associate Professor at Wuhan Institute of Technology in 2014. His research interest is thermal conductive polymer composites and acoustic materials.

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Du, YK., Shi, ZX., Dong, S. et al. Recent Progress in Fabrication and Structural Design of Thermal Conductive Polymer Composites. Chin J Polym Sci 42, 277–291 (2024). https://doi.org/10.1007/s10118-023-3057-5

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