Abstract
Surface properties of stainless steel on nucleation and growth of copper under electrorefining conditions were studied using AISI 316L type stainless steel in rotating disc electrodes (RDE), stationary electrodes and Hull cell, and also worn industrial cathode blanks. The aim was to find correlations between surface topography and nucleation and growth using deposition tests, microscopy, and image analysis. Deposition tests were done galvanostatically using synthetic copper electrorefining electrolyte and current density 330 A/m2 typical in electrorefining. On the as-received stainless steel with 2B finish, nucleation happened at grain boundaries. Wet grinding resulted in deposition on the ridges and valleys of rough surface and ridges of smooth surface. The nucleation density was in the order of 106 nuclei/cm2 in RDE and Hull cell tests, and 105 nuclei/cm2 in stationary electrode tests. Used industrial blanks did not show the same deposition patterns on grain boundaries and scratch marks, and copper deposited on edges of larger damages. The nucleation density on industrial blanks was in the order of 103 nuclei/cm2.
Similar content being viewed by others
References
Winand R (1998) Contribution to the study of copper electrocrystallization in view of industrial applications—submicroscopic and macroscopic considerations. Electrochim Acta 43(19–20):2925–2932
Plieth W (2010) The process chain of electrodeposition. Russ J Electrochem 46(10):1119–1124
Plieth W (2011) Electrocrystallization—factors influencing structure. J Solid State Electrochem 15:1417–1423
Budevski E, Staikov G, Lorenz WJ (1996) Electrochemical phase formation and growth. VCH, Weinheim
Zapryanova T, Jordanov N, Milchev A (2008) Electrochemical growth of single copper crystals on glassy carbon and tungsten substrates. J Electroanal Chem 612:47–52
Chang H, Choe B-H, Lee J (2005) Influence of titanium oxide films on copper nucleation during electrodeposition. Mater Sci Eng, A 409:317–328
Heerman L, Tarallo A (1999) Theory of the chronoamperometric transient for electrochemical nucleation with diffusion-controlled growth. J Electroanal Chem 470:70–76
Prentice G, Chen K (1998) Effects of current density on adhesion of copper electrodeposits to polyimide substrates. J Appl Electrochem 28(9):971–977
Vanden Brande P, Winand R (1993) First stages of the formation of copper electrodeposits and copper sputtered deposits on amorphous carbon and polycrystalline silver substrates. J Appl Electrochem 23:1089–1096
Grujicic D, Pesic B (2002) Electrodeposition of copper: the nucleation mechanisms. Electrochim Acta 47:2901–2912
Arzhanova T, Golikov A (2005) Spatial distribution of copper nuclei electrodeposited on glassy carbon under galvanostatic conditions. Corros Sci 47:723–734
Sun H, Delplancke J, Winand R, O’Keefe TJ (1991) Nucleation and growth of copper electrodeposits on titanium substrates. In: Copper–Cobre 91. pp 405–417
Kim S-B, Kim K-T, Park C-J, Kwon H-S (2002) Electrochemical nucleation and growth of copper on chromium-plated electrodes. J Appl Electrochem 32(11):1247–1255
Rao G, Cooper W (1979) The electrodeposition of copper on film-covered metal surfaces. Hydrometallurgy 4:185–207
Delplancke J-L, Sun M, O’Keefe T, Winand R (1990) Production of thin copper foils on microporous titanium oxide substrates. Hydrometallurgy 24:179–187
Zhou Z, O’Keefe T (1998) Electrodeposition of copper on thermally oxidized 316L stainless steel substrates. J Appl Electrochem 28:461–469
Urda-Kiel M, Oniciu L, Delplancke J-L, Winand R (1999) Nucleation and initial stages of copper electrodeposition on anodized 304 stainless steel. In: Dutrizac J, Ji J, Ramachandran V (eds) Copper 99–Cobre 99, Phoenix, Arizona, TMS, pp 511–528
O’Keefe TJ, Hurst L (1978) The effect of antimony, chloride ion, and glue on copper electrorefining. J Appl Electrochem 8:109–119
Moats M, Davenport W, Robinson T, Karcas G, Demetrio S (2007) Electrolytic copper refining—2007 world tankhouse data. In: Houlachi G, Edwards G, Robinson T (eds) Cu 2007, Toronto, Canada. Met Soc, pp 195–241
Zapryanova T, Hrussanova A, Milchev A (2007) Nucleation and growth of copper on glassy carbon: studies in extended overpotential interval. J Electroanal Chem 600:311–317
Peykova M, Michailova E, Stoychev D, Milchev A (1995) Galvanostatic studies of the nucleation and growth kinetics of copper in the presence of surfactants. Electrochim Acta 40(16):2595–2601
Acknowledgments
This work was financially supported by the International Copper Sponsor Group. The authors are grateful to the Group members for permission to publish the results.
Author information
Authors and Affiliations
Corresponding author
Additional information
Dedicated to the 75th birthday of Professor Waldfried Plieth
Rights and permissions
About this article
Cite this article
Aromaa, J., Kekki, A., Stefanova, A. et al. Copper nucleation and growth patterns on stainless steel cathode blanks in copper electrorefining. J Solid State Electrochem 16, 3529–3537 (2012). https://doi.org/10.1007/s10008-012-1898-x
Received:
Revised:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s10008-012-1898-x