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Copper nucleation and growth patterns on stainless steel cathode blanks in copper electrorefining

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Abstract

Surface properties of stainless steel on nucleation and growth of copper under electrorefining conditions were studied using AISI 316L type stainless steel in rotating disc electrodes (RDE), stationary electrodes and Hull cell, and also worn industrial cathode blanks. The aim was to find correlations between surface topography and nucleation and growth using deposition tests, microscopy, and image analysis. Deposition tests were done galvanostatically using synthetic copper electrorefining electrolyte and current density 330 A/m2 typical in electrorefining. On the as-received stainless steel with 2B finish, nucleation happened at grain boundaries. Wet grinding resulted in deposition on the ridges and valleys of rough surface and ridges of smooth surface. The nucleation density was in the order of 106 nuclei/cm2 in RDE and Hull cell tests, and 105 nuclei/cm2 in stationary electrode tests. Used industrial blanks did not show the same deposition patterns on grain boundaries and scratch marks, and copper deposited on edges of larger damages. The nucleation density on industrial blanks was in the order of 103 nuclei/cm2.

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References

  1. Winand R (1998) Contribution to the study of copper electrocrystallization in view of industrial applications—submicroscopic and macroscopic considerations. Electrochim Acta 43(19–20):2925–2932

    Article  CAS  Google Scholar 

  2. Plieth W (2010) The process chain of electrodeposition. Russ J Electrochem 46(10):1119–1124

    Article  CAS  Google Scholar 

  3. Plieth W (2011) Electrocrystallization—factors influencing structure. J Solid State Electrochem 15:1417–1423

    Article  CAS  Google Scholar 

  4. Budevski E, Staikov G, Lorenz WJ (1996) Electrochemical phase formation and growth. VCH, Weinheim

    Book  Google Scholar 

  5. Zapryanova T, Jordanov N, Milchev A (2008) Electrochemical growth of single copper crystals on glassy carbon and tungsten substrates. J Electroanal Chem 612:47–52

    Article  CAS  Google Scholar 

  6. Chang H, Choe B-H, Lee J (2005) Influence of titanium oxide films on copper nucleation during electrodeposition. Mater Sci Eng, A 409:317–328

    Article  Google Scholar 

  7. Heerman L, Tarallo A (1999) Theory of the chronoamperometric transient for electrochemical nucleation with diffusion-controlled growth. J Electroanal Chem 470:70–76

    Article  CAS  Google Scholar 

  8. Prentice G, Chen K (1998) Effects of current density on adhesion of copper electrodeposits to polyimide substrates. J Appl Electrochem 28(9):971–977

    Article  CAS  Google Scholar 

  9. Vanden Brande P, Winand R (1993) First stages of the formation of copper electrodeposits and copper sputtered deposits on amorphous carbon and polycrystalline silver substrates. J Appl Electrochem 23:1089–1096

    Article  CAS  Google Scholar 

  10. Grujicic D, Pesic B (2002) Electrodeposition of copper: the nucleation mechanisms. Electrochim Acta 47:2901–2912

    Article  CAS  Google Scholar 

  11. Arzhanova T, Golikov A (2005) Spatial distribution of copper nuclei electrodeposited on glassy carbon under galvanostatic conditions. Corros Sci 47:723–734

    Article  CAS  Google Scholar 

  12. Sun H, Delplancke J, Winand R, O’Keefe TJ (1991) Nucleation and growth of copper electrodeposits on titanium substrates. In: Copper–Cobre 91. pp 405–417

  13. Kim S-B, Kim K-T, Park C-J, Kwon H-S (2002) Electrochemical nucleation and growth of copper on chromium-plated electrodes. J Appl Electrochem 32(11):1247–1255

    Article  CAS  Google Scholar 

  14. Rao G, Cooper W (1979) The electrodeposition of copper on film-covered metal surfaces. Hydrometallurgy 4:185–207

    Article  CAS  Google Scholar 

  15. Delplancke J-L, Sun M, O’Keefe T, Winand R (1990) Production of thin copper foils on microporous titanium oxide substrates. Hydrometallurgy 24:179–187

    Article  CAS  Google Scholar 

  16. Zhou Z, O’Keefe T (1998) Electrodeposition of copper on thermally oxidized 316L stainless steel substrates. J Appl Electrochem 28:461–469

    Article  CAS  Google Scholar 

  17. Urda-Kiel M, Oniciu L, Delplancke J-L, Winand R (1999) Nucleation and initial stages of copper electrodeposition on anodized 304 stainless steel. In: Dutrizac J, Ji J, Ramachandran V (eds) Copper 99–Cobre 99, Phoenix, Arizona, TMS, pp 511–528

  18. O’Keefe TJ, Hurst L (1978) The effect of antimony, chloride ion, and glue on copper electrorefining. J Appl Electrochem 8:109–119

    Article  Google Scholar 

  19. Moats M, Davenport W, Robinson T, Karcas G, Demetrio S (2007) Electrolytic copper refining—2007 world tankhouse data. In: Houlachi G, Edwards G, Robinson T (eds) Cu 2007, Toronto, Canada. Met Soc, pp 195–241

  20. Zapryanova T, Hrussanova A, Milchev A (2007) Nucleation and growth of copper on glassy carbon: studies in extended overpotential interval. J Electroanal Chem 600:311–317

    Article  CAS  Google Scholar 

  21. Peykova M, Michailova E, Stoychev D, Milchev A (1995) Galvanostatic studies of the nucleation and growth kinetics of copper in the presence of surfactants. Electrochim Acta 40(16):2595–2601

    Article  CAS  Google Scholar 

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Acknowledgments

This work was financially supported by the International Copper Sponsor Group. The authors are grateful to the Group members for permission to publish the results.

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Correspondence to Jari Aromaa.

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Dedicated to the 75th birthday of Professor Waldfried Plieth

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Aromaa, J., Kekki, A., Stefanova, A. et al. Copper nucleation and growth patterns on stainless steel cathode blanks in copper electrorefining. J Solid State Electrochem 16, 3529–3537 (2012). https://doi.org/10.1007/s10008-012-1898-x

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  • DOI: https://doi.org/10.1007/s10008-012-1898-x

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