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Wafer level encapsulation of microsystems using glass frit bonding

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Abstract

This paper gives an introduction to glass frit wafer bonding, which is an universally useable technology for encapsulation of microsystems, especially surface micromechanical sensors on wafer level. After a process description, some mechanical as well as electrical characteristics of glass frit bonded wafers are discussed and applications are shown.

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References

  1. Simon I “Sensorverkapselung: Messtechnische Untersuchungen” HSG-IMIT Report BMBF-Project MANGHO

  2. Moraja M, Amiotti A, Longini G (2003) Patterned getter film wafers for wafer level packaging of MEMS. Micro System Technologies München

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Authors and Affiliations

  1. X-FAB Semiconductor Foundries AG, Haarbergstraße 67, 99097, Erfurt, Germany

    R. Knechtel

  2. Fraunhofer IZM Chemnitz, Berlin, Germany

    M. Wiemer & J. Frömel

Authors
  1. R. Knechtel
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  2. M. Wiemer
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  3. J. Frömel
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Correspondence to R. Knechtel.

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Knechtel, R., Wiemer, M. & Frömel, J. Wafer level encapsulation of microsystems using glass frit bonding. Microsyst Technol 12, 468–472 (2006). https://doi.org/10.1007/s00542-005-0036-4

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  • DOI: https://doi.org/10.1007/s00542-005-0036-4

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